TLV2474AIPWP
- Mfr.Part #
- TLV2474AIPWP
- Manufacturer
- Texas Instruments
- Package / Case
- 14-PowerTSSOP (0.173, 4.40mm Width)
- Datasheet
- Download
- Description
- IC CMOS 4 CIRCUIT 14HTSSOP
- Stock
- 24,118
- In Stock :
- 24,118
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- Manufacturer :
- Texas Instruments
- Product Category :
- Instrumentation, OP Amps, Buffer Amps
- Pin Count :
- 14
- Power Supplies :
- +-1.35/+-3/2.7/6V
- Width :
- 4.4mm
- Output Current :
- 35mA
- Low-Bias :
- yes
- Micropower :
- No
- Peak Reflow Temperature (Cel) :
- 260
- Low-Offset :
- No
- ECCN Code :
- EAR99
- Slew Rate :
- 1.5V/µs
- Base Part Number :
- TLV2474
- Architecture :
- VOLTAGE-FEEDBACK
- Number of Functions :
- 4
- Number of Elements :
- 4
- Voltage - Input Offset :
- 250μV
- Number of Terminations :
- 14
- Input Offset Voltage (Vos) :
- 1.6mV
- Supply Voltage :
- 3V
- Voltage - Supply, Single/Dual (±) :
- 2.7V~6V ±1.35V~3V
- Common Mode Rejection Ratio :
- 61 dB
- Lead Free :
- Lead Free
- Programmable Power :
- No
- Operating Supply Current :
- 600μA
- Nominal Supply Current :
- 3.6mA
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- Dual
- Input Offset Current-Max (IIO) :
- 0.00005μA
- Surface Mount :
- yes
- Length :
- 5mm
- Operating Temperature :
- -40°C~125°C
- Factory Lead Time :
- 6 Weeks
- Frequency Compensation :
- yes
- Power Dissipation :
- 4.07W
- Voltage Gain :
- 120dB
- Bandwidth :
- 2.8MHz
- Supply Voltage Limit-Max :
- 7V
- Thickness :
- 1mm
- Output Type :
- Rail-to-Rail
- Lifecycle Status :
- ACTIVE (Last Updated: 6 days ago)
- Package / Case :
- 14-PowerTSSOP (0.173, 4.40mm Width)
- Pbfree Code :
- yes
- Moisture Sensitivity Level (MSL) :
- 2 (1 Year)
- Max I/O Voltage :
- 1.6mV
- Bias Current-Max (IIB) @25C :
- 0.00005μA
- Amplifier Type :
- GENERAL PURPOSE
- JESD-609 Code :
- e4
- Output Current per Channel :
- 35mA
- Mounting Type :
- Surface Mount
- Number of Pins :
- 14
- Height :
- 1.2mm
- Radiation Hardening :
- No
- Packaging :
- Tube
- Terminal Finish :
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Unity Gain BW-Nom :
- 2800 kHz
- Operating Supply Voltage :
- 3V
- Average Bias Current-Max (IIB) :
- 0.0003μA
- Terminal Form :
- Gull wing
- Current - Input Bias :
- 2.5pA
- Datasheets
- TLV2474AIPWP

Instrumentation OP Amps Buffer Amps Texas Instruments TLV2474AIPWP Overview
Introducing the TLV2474AIPWP from Texas Instruments, a leading-edge integrated circuit designed for high-performance applications in instrumentation, operational amplifiers (op amps), and buffer amplifiers. This CMOS 4 circuit, 14HTSSOP package offers unparalleled precision and reliability, making it an ideal choice for demanding industrial and commercial projects.
Engineered with cutting-edge technology, this IC delivers exceptional performance across a wide range of operating conditions. Its compact form factor and low power consumption make it suitable for space-constrained designs, while its robust construction ensures long-term stability and durability.
Whether you're designing precision measurement instruments, signal conditioning circuits, or sensor interfaces, the TLV2474AIPWP sets a new standard for excellence in integrated circuitry. Experience the power of Texas Instruments innovation with this versatile and dependable solution.
TLV2474AIPWP Features
- CMOS 4 circuit design
- 14HTSSOP package
- Precision performance
- Low power consumption
- Wide operating range
- Compact form factor
- Robust construction for durability
TLV2474AIPWP Applications
- Precision Measurement Instruments: The TLV2474AIPWP excels in applications requiring accurate signal processing and conditioning, making it an ideal choice for high-precision measurement instruments such as digital multimeters and oscilloscopes.
- Signal Conditioning Circuits: With its precision performance and wide operating range, this IC is well-suited for signal conditioning circuits used in industrial automation systems, ensuring reliable operation in harsh environments.
- Sensor Interfaces: Leveraging its low power consumption and compact form factor, the TLV2474AIPWP is perfect for sensor interface circuits in automotive, aerospace, and consumer electronics applications, enabling seamless integration and efficient data acquisition.
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