TFM-103-13-L-D
- Mfr.Part #
- TFM-103-13-L-D
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 6POS 1.27MM
- Stock
- 17,910
- In Stock :
- 17,910
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Voltage - Rated :
- 275VAC
- Insulation Color :
- Black
- Contact Type :
- Male Pin
- Packaging :
- Tube
- Row Spacing - Mating :
- 0.050 (1.27mm)
- Shrouding :
- Shrouded - 4 Wall
- Number of Rows :
- 2
- Contact Finish - Post :
- Tin
- Insulation Height :
- 0.290 7.37mm
- Contact Finish - Mating :
- Gold
- Contact Finish Thickness - Mating :
- 15.0μin 0.38μm
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Current Rating (Amps) :
- 2.9A per Contact
- Style :
- Board to Board or Cable
- Contact Material :
- Phosphor Bronze
- Number of Positions Loaded :
- All
- RoHS Status :
- ROHS3 Compliant
- Contact Length - Post :
- 0.111 2.82mm
- Number of Positions :
- 6
- Contact Length - Mating :
- 0.139 3.53mm
- Material Flammability Rating :
- UL94 V-0
- Factory Lead Time :
- 3 Weeks
- Fastening Type :
- Push-Pull
- Connector Type :
- Header
- Termination :
- Solder
- Mounting Type :
- Through Hole
- Pitch - Mating :
- 0.050 1.27mm
- Operating Temperature :
- -55°C~125°C
- Contact Shape :
- Square
- Series :
- Tiger Eye™ TFM
- Datasheets
- TFM-103-13-L-D
Tiger Eye™ TFM Series 2-Row Header Solder Phosphor Bronze Tube Through Hole Gold Liquid Crystal Polymer (LCP) 6-Position Board to Board or Cable 0.290 7.37mm Height
TFM-103-13-L-D Overview
A Header package is included with it.Its mounting type is Through Hole.Packaging is performed using a Tube case.It is part of the Tiger Eye™ TFM Series of products.There is no operating temperature for the device.
TFM-103-13-L-D Features
Tiger Eye™ TFM series
TFM-103-13-L-D Applications
There are a lot of Samtec Inc.
TFM-103-13-L-D Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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