T1M-08-GF-DV
- Mfr.Part #
- T1M-08-GF-DV
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER SMD 16POS 1MM
- Stock
- 37,601
- In Stock :
- 37,601
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Contact Finish Thickness - Mating :
- 3.00μin 0.076μm
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Factory Lead Time :
- 3 Weeks
- Connector Type :
- Header
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tube
- Insulation Height :
- 0.268 6.80mm
- Contact Type :
- Male Pin
- Material Flammability Rating :
- UL94 V-0
- Operating Temperature :
- -55°C~85°C
- Number of Rows :
- 2
- Termination :
- Solder
- Number of Positions Loaded :
- All
- Fastening Type :
- Locking Ramp
- Contact Material :
- Phosphor Bronze
- Insulation Color :
- Natural
- Series :
- T1M
- Feature :
- Pick and Place
- Shrouding :
- Shrouded - 4 Wall
- Style :
- Board to Cable/Wire
- Voltage - Rated :
- 250VAC 353VDC
- Contact Finish Thickness - Post :
- 3.00μin 0.076μm
- Current Rating (Amps) :
- 3.3A per Contact
- Pitch - Mating :
- 0.039 1.00mm
- Row Spacing - Mating :
- 0.077 (1.96mm)
- Contact Finish - Mating :
- Gold
- Contact Shape :
- Square
- Number of Positions :
- 16
- Mounting Type :
- Surface Mount
- Datasheets
- T1M-08-GF-DV
T1M Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 16-Position Board to Cable/Wire 0.268 6.80mm Height
T1M-08-GF-DV-K Overview
A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tube case.It is part of the T1M Series of products.A number of features make it more powerful because of its Pick and Place feature.There is no operating temperature for the device.
T1M-08-GF-DV-K Features
T1M series
T1M-08-GF-DV-K Applications
There are a lot of Samtec Inc.
T1M-08-GF-DV-K Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
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