SPC5777CK3MMO3R
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- Mfr.Part #
- SPC5777CK3MMO3R
- Manufacturer
- NXP Semiconductors
- Package / Case
- 516-BGA
- Datasheet
- Download
- Description
- IC MCU 32BIT 8MB FLASH 516MAPBGA
- Stock
- 1,303
- In Stock ：
- 1,303
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Microcontrollers
- Core Processor :
- e200z7
- Program Memory Type :
- Flash
- Data Converter :
- A/D 16b Sigma-Delta, eQADC
- Packaging :
- Tape and Reel (TR)
- RAM Size :
- 512K x 8
- Factory Lead Time :
- 16 Weeks
- Oscillator Type :
- Internal
- Peripherals :
- DMA, LVD, POR, Zipwire
- Program Memory Size :
- 8MB 8M x 8
- Series :
- MPC57xx
- RoHS Status :
- ROHS3 Compliant
- Connectivity :
- CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Operating Temperature :
- -40°C~125°C TA
- Voltage - Supply (Vcc/Vdd) :
- 3V~5.5V
- Core Size :
- 32-Bit Tri-Core
- Speed :
- 264MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Package / Case :
- 516-BGA
- Datasheets
- SPC5777CK3MMO3R
Microcontrollers NXP Semiconductors SPC5777CK3MMO3R Overview
The Microcontrollers NXP Semiconductors SPC5777CK3MMO3R is a state-of-the-art microcontroller unit (MCU) designed to meet the rigorous demands of modern embedded systems. Engineered by NXP Semiconductors, a leader in the semiconductor industry, this MCU features a 32-bit processing core and an extensive 8MB of flash memory, housed in a compact 516-pin MAPBGA package. Ideal for applications requiring high-performance computation and substantial code storage, this microcontroller ensures reliability and efficiency in complex electronic systems.
SPC5777CK3MMO3R Features
This microcontroller is equipped with advanced features that enhance its versatility and functionality across various industries. Key features include its 32-bit architecture that offers robust computational capabilities, 8MB flash memory for ample program storage, high-speed interfaces for rapid data transfer, and a low-power design that ensures energy efficiency. The integration in a 516-pin MAPBGA package allows for a compact footprint and excellent thermal performance, making it suitable for densely packed electronics.
SPC5777CK3MMO3R Applications
- Automotive Control Systems: Utilized in engine management systems and advanced driver-assistance systems (ADAS) to process real-time data and control vehicle dynamics efficiently.
- Industrial Automation: Powers complex machinery controls, such as robotic arms and automated assembly lines, where precision and reliability are crucial.
- Medical Devices: Embedded in medical diagnostic equipment to handle intricate processing of biomedical data and support critical health applications.
- Consumer Electronics: Integrated into smart home devices and entertainment systems, providing core processing capabilities that enhance user experience and connectivity.
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