SPC5777CK3MMO3

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Mounting Type :

Surface Mount

Program Memory Size :

8MB 8M x 8

Package / Case :

516-BGA

HTS Code :

8542.31.00.01

Bit Size :

32

Additional Feature :

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

Factory Lead Time :

16 Weeks

Operating Temperature :

-40°C~125°C TA

Supply Voltage-Max (Vsup) :

1.32V

RAM (bytes) :

524288

RAM Size :

512K x 8

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Oscillator Type :

Internal

DAC Channels :

No

Core Processor :

e200z7

Terminal Pitch :

1mm

Connectivity :

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

Supply Voltage-Min (Vsup) :

1.2V

Voltage - Supply (Vcc/Vdd) :

3V~5.5V

Data Converter :

A/D 16b Sigma-Delta, eQADC

Height Seated (Max) :

2.02mm

JESD-30 Code :

S-PBGA-B516

Series :

MPC57xx

Terminal Form :

Ball

Program Memory Type :

Flash

Number of Terminations :

516

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

On Chip Program ROM Width :

8

Surface Mount :

yes

Core Size :

32-Bit Tri-Core

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

ROM (words) :

8388608

Terminal Position :

BOTTOM

Speed :

264MHz

PWM Channels :

yes

Length :

27mm

Clock Frequency :

40MHz

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Peripherals :

DMA, LVD, POR, Zipwire

Width :

27mm

DMA Channels :

yes

Published :

2016

RoHS Status :

ROHS3 Compliant

Has ADC :

yes

ECCN Code :

5A992