SPC5777CDK3MMO3R

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Core Size :

32-Bit Tri-Core

JESD-30 Code :

S-PBGA-B516

DMA Channels :

yes

On Chip Program ROM Width :

8

Has ADC :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Bit Size :

32

ROM (words) :

8388608

Core Processor :

e200z7

Data Converter :

A/D 16b Sigma-Delta, eQADC

Additional Feature :

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

Mounting Type :

Surface Mount

Time@Peak Reflow Temperature-Max (s) :

40

Program Memory Size :

8MB 8M x 8

Peripherals :

DMA, LVD, POR, Zipwire

DAC Channels :

No

Surface Mount :

yes

RAM (bytes) :

524288

Peak Reflow Temperature (Cel) :

260

Terminal Form :

Ball

Package / Case :

516-BGA

Height Seated (Max) :

2.02mm

Packaging :

Tape and Reel (TR)

Factory Lead Time :

16 Weeks

RoHS Status :

ROHS3 Compliant

Width :

27mm

RAM Size :

512K x 8

Clock Frequency :

40MHz

Terminal Position :

BOTTOM

Oscillator Type :

Internal

Supply Voltage-Max (Vsup) :

1.32V

Series :

MPC57xx

PWM Channels :

yes

Length :

27mm

Number of Terminations :

516

Program Memory Type :

Flash

Connectivity :

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

Operating Temperature :

-40°C~125°C TA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Pitch :

1mm

Speed :

264MHz

Supply Voltage-Min (Vsup) :

1.2V

Voltage - Supply (Vcc/Vdd) :

3V~5.5V