SPC5777CCK3MMO3

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Length :

27mm

Published :

2012

HTS Code :

8542.31.00.01

PWM Channels :

yes

Has ADC :

yes

Connectivity :

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA Channels :

yes

Package / Case :

516-BGA

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Series :

MPC57xx

Data Converter :

A/D 16b Sigma-Delta, eQADC

RAM Size :

512K x 8

JESD-30 Code :

S-PBGA-B516

Mounting Type :

Surface Mount

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Voltage - Supply (Vcc/Vdd) :

3V~5.5V

Factory Lead Time :

16 Weeks

Packaging :

Tray

Terminal Pitch :

1mm

RAM (bytes) :

524288

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Program Memory Type :

Flash

Width :

27mm

ROM (words) :

8388608

Terminal Form :

Ball

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Program Memory Size :

8MB 8M x 8

Bit Size :

32

ECCN Code :

5A992

Supply Voltage-Max (Vsup) :

1.32V

Height Seated (Max) :

2.02mm

Supply Voltage-Min (Vsup) :

1.2V

Oscillator Type :

Internal

On Chip Program ROM Width :

8

DAC Channels :

No

Operating Temperature :

-40°C~125°C TA

RoHS Status :

ROHS3 Compliant

Clock Frequency :

40MHz

Peripherals :

DMA, LVD, POR, Zipwire

Speed :

264MHz

Surface Mount :

yes

Core Processor :

e200z7

Additional Feature :

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

Core Size :

32-Bit Tri-Core

Number of Terminations :

516