SPAKXC309VF100A

Manufacturer :

NXP Semiconductors

Product Category :

DSP (Digital Signal Processors)

Peak Reflow Temperature (Cel) :

220

Terminal Position :

BOTTOM

Width :

15mm

HTS Code :

8542.31.00.01

Base Part Number :

SPAKXC309

Type :

FIXED POINT

Boundary Scan :

yes

Time@Peak Reflow Temperature-Max (s) :

30

JESD-30 Code :

S-PBGA-B196

Supply Voltage-Max (Vsup) :

3.6V

Package / Case :

196-LBGA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

DSP563xx

Address Bus Width :

18

Voltage - I/O :

3.30V

Qualification Status :

Not Qualified

On Chip Data RAM :

24KB

Terminal Pitch :

1mm

Internal Bus Architecture :

Multiple

Interface :

Host Interface, SSI, SCI

Packaging :

Tray

Terminal Form :

Ball

Mounting Type :

Surface Mount

Supply Voltage :

3.3V

Clock Frequency :

100MHz

Operating Temperature :

-40°C~105°C TJ

Clock Rate :

100MHz

Surface Mount :

yes

Low Power Mode :

yes

ECCN Code :

3A001.A.3

Number of Terminations :

196

Barrel Shifter :

yes

Length :

15mm

RoHS Status :

Non-RoHS Compliant

Non-Volatile Memory :

ROM (576B)

Height Seated (Max) :

1.6mm

Published :

2005

Supply Voltage-Min (Vsup) :

3V

External Data Bus Width :

24