SM32C6416TGLZI1EP
- Mfr.Part #
- SM32C6416TGLZI1EP
- Manufacturer
- Texas Instruments
- Package / Case
- 532-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP FIXED-POINT 532-FCBGA
- Stock
- 34,144
- In Stock :
- 34,144
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- RoHS Status :
- ROHS3 Compliant
- Number of I/O :
- 16
- Operating Temperature :
- -40°C~85°C TC
- Base Part Number :
- 32C6416
- Weight :
- 3.131403g
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Internal Bus Architecture :
- Multiple
- Qualification Status :
- Not Qualified
- Lead Free :
- Contains Lead
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Data Bus Width :
- 32b
- Voltage - I/O :
- 3.30V
- Terminal Form :
- Ball
- ECCN Code :
- 3A001.A.3
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Mounting Type :
- Surface Mount
- Min Supply Voltage :
- 1.16V
- Reach Compliance Code :
- not_compliant
- Package / Case :
- 532-BFBGA, FCBGA
- Non-Volatile Memory :
- External
- Boundary Scan :
- yes
- Terminal Pitch :
- 0.8mm
- Packaging :
- Tray
- Pin Count :
- 532
- Voltage - Core :
- 1.25V
- Frequency :
- 1GHz
- HTS Code :
- 8542.31.00.01
- Number of Pins :
- 532
- Type :
- FIXED POINT
- Series :
- TMS320C6414T/15T/16T
- Interface :
- Host Interface, McBSP, PCI, UTOPIA
- Address Bus Width :
- 23
- Power Supplies :
- 1.23.3V
- Low Power Mode :
- yes
- On Chip Data RAM :
- 1.03MB
- Length :
- 23mm
- Number of Terminations :
- 532
- Operating Supply Voltage :
- 1.2V
- Additional Feature :
- ALSO REQUIRES 3.3V SUPPLY
- Max Supply Voltage :
- 3.46V
- Bit Size :
- 32
- Height Seated (Max) :
- 3.25mm
- Barrel Shifter :
- No
- Supply Voltage :
- 1.2V
- Datasheets
- SM32C6416TGLZI1EP

DSP Texas Instruments SM32C6416TGLZI1EP Overview
The DSP Texas Instruments SM32C6416TGLZI1EP represents a pinnacle of technological achievement in the field of fixed-point digital signal processors. Engineered by Texas Instruments, a leader in semiconductor innovation, this IC (Integrated Circuit) is designed for demanding applications that require high performance, reliability, and precision. Housed in a 532-pin FCBGA (Fine Pitch Ball Grid Array) package, this DSP is optimized for enhanced thermal and electrical connectivity, ensuring stable performance even under intense operating conditions. Its robust design and advanced technology make it an ideal choice for industries looking to integrate high-speed signal processing capabilities into their sophisticated systems.
SM32C6416TGLZI1EP Features
The SM32C6416TGLZI1EP DSP is equipped with a multitude of features that make it a powerful tool for processing complex digital signals. It offers a high level of integration which simplifies board design and reduces system costs. Key features include a high-performance processing core, multiple connectivity options, and support for various signal processing algorithms which are essential for applications ranging from audio processing to industrial control systems.
SM32C6416TGLZI1EP Applications
- Telecommunications: This DSP is crucial in managing data flow and signal integrity in communication infrastructure, enhancing bandwidth and reducing latency.
- Audio Processing: Utilized in high-fidelity audio systems for effects processing and sound enhancement, ensuring crystal clear audio reproduction.
- Industrial Control Systems: Helps in the precise control and monitoring of industrial equipment, optimizing performance and safety.
- Medical Imaging: Applied in medical diagnostic equipment, improving image processing capabilities which are critical for accurate diagnoses.
- Aerospace and Defense: Employs advanced algorithms for radar and other signal processing tasks that are essential for navigation and surveillance.
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