SM32C6416TBGLZI1EP

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Mfr.Part #
SM32C6416TBGLZI1EP
Manufacturer
Texas Instruments
Package / Case
532-BFBGA, FCBGA
Datasheet
Download
Description
IC DSP FIXED-POINT 532-FCBGA
Stock
119
In Stock :
119

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Operating Supply Voltage :
3.3V
Thickness :
2.61mm
Peak Reflow Temperature (Cel) :
220
Number of Terminations :
532
Series :
TMS320C6414T/15T/16T
Frequency :
1GHz
Number of Timers/Counters :
3
Non-Volatile Memory :
External
Memory Type :
Cache
Bit Size :
32
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Pins :
532
Pin Count :
532
RAM (words) :
4096
RAM Size :
1Mb
Lead Free :
Contains Lead
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
On Chip Data RAM :
1.03MB
Data Bus Width :
32b
Terminal Finish :
Tin/Lead (Sn/Pb)
Boundary Scan :
yes
Package / Case :
532-BFBGA, FCBGA
Factory Lead Time :
12 Weeks
Width :
23mm
Type :
FIXED POINT
Terminal Position :
BOTTOM
Length :
23mm
Voltage - I/O :
3.30V
Operating Temperature :
-40°C~85°C TC
Interface :
Host Interface, McBSP, PCI, UTOPIA
Integrated Cache :
yes
Number of DMA Channels :
64
Max Supply Voltage :
3.46V
JESD-609 Code :
e0
Internal Bus Architecture :
Multiple
Number of External Interrupts :
4
Height :
3.25mm
Terminal Pitch :
0.8mm
Radiation Hardening :
No
Memory Size :
32kB
Mounting Type :
Surface Mount
Packaging :
Tube
Base Part Number :
32C6416
Voltage - Core :
1.25V
Barrel Shifter :
No
Low Power Mode :
yes
Supply Voltage :
1.2V
Mount :
Surface Mount
Lifecycle Status :
ACTIVE (Last Updated: 4 days ago)
Min Supply Voltage :
1.05V
Introducing DSP (Digital Signal Processors) Texas Instruments SM32C6416TBGLZI1EP from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:532, Number of Pins:532, Package / Case:532-BFBGA, FCBGA, Type:FIXED POINT, Operating Temperature:-40°C~85°C TC, Mounting Type:Surface Mount, Base Part Number:32C6416, SM32C6416TBGLZI1EP pinout, SM32C6416TBGLZI1EP datasheet PDF, SM32C6416TBGLZI1EP amp .Beyond DSP (Digital Signal Processors) Texas Instruments SM32C6416TBGLZI1EP ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments SM32C6416TBGLZI1EP


DSP Texas Instruments SM32C6416TBGLZI1EP Overview

The DSP Texas Instruments SM32C6416TBGLZI1EP is a high-performance digital signal processor designed specifically for demanding applications that require intensive fixed-point processing power. This IC is housed in a 532-FCBGA package, offering advanced capabilities for robust signal manipulation and processing tasks. This product leverages Texas Instruments' renowned technology to deliver superior speed and efficiency, making it an ideal choice for developers aiming to build sophisticated digital processing systems. Its integration features and scalability make it particularly attractive for high-volume applications, ensuring a blend of performance, power efficiency, and cost-effectiveness.

SM32C6416TBGLZI1EP Features

This digital signal processor is equipped with an array of features designed to enhance system reliability, performance, and flexibility. Key features include advanced fixed-point processing capabilities, a high degree of integration which reduces the need for multiple chips, and a compact 532-FCBGA package that fits into tight spaces and simplifies PCB design. Furthermore, its compatibility with a wide range of software tools facilitates easier development and quicker time-to-market for complex applications.

SM32C6416TBGLZI1EP Applications

  • Automotive Audio Systems: Utilized in advanced audio processing to deliver crystal clear sound quality and support complex audio algorithms in car entertainment systems.
  • Industrial Control Systems: Helps in managing and optimizing the operation of machinery and equipment through high-speed signal processing, enhancing automation and precision in industrial settings.
  • Medical Imaging Devices: Critical for processing complex data in real-time, ensuring that medical imaging devices such as ultrasound and MRI deliver accurate and timely results.
  • Telecommunications Infrastructure: Supports the processing demands of telecommunications equipment, enhancing data throughput and network reliability in communication systems.
  • Consumer Electronics: Applied in devices like digital cameras and video recorders, improving image and video quality through sophisticated signal processing algorithms.
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