R7FS7G27H2A01CBG#AC0
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- Mfr.Part #
- R7FS7G27H2A01CBG#AC0
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 176-LFBGA
- Datasheet
- Download
- Description
- IC MCU 32BIT 4MB FLASH 176LFBGA
- Stock
- 1,108
- In Stock ：
- 1,108
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Microcontrollers
- Program Memory Type :
- Flash
- Core Size :
- 32-Bit
- Length :
- 6mm
- Speed :
- 24 MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 6mm
- Factory Lead Time :
- 12 Weeks
- Frequency :
- 240MHz
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Terminal Position :
- QUAD
- Lead Free :
- Lead Free
- Pbfree Code :
- yes
- Data Converter :
- A/D 21x12b; D/A 2x12b
- Surface Mount :
- yes
- Number of I/O :
- 126
- Pin Count :
- 176
- EEPROM Size :
- 64K x 8
- Operating Temperature :
- -40°C~85°C TA
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, IrDA, MMC, SCI, SD, SPI, UART, USART, USB
- Core Architecture :
- ARM
- Series :
- Renesas Synergy™ S7
- PWM Channels :
- yes
- Packaging :
- Tray
- Oscillator Type :
- Internal
- RoHS Status :
- ROHS3 Compliant
- Peripherals :
- DMA, LCD, LVD, POR, PWM, WDT
- Supply Voltage :
- 3.3V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Package / Case :
- 176-LFBGA
- Supply Voltage-Min (Vsup) :
- 2.7V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Terminations :
- 48
- Address Bus Width :
- 24
- Program Memory Size :
- 4MB 4M x 8
- Terminal Pitch :
- 0.5mm
- Voltage - Supply (Vcc/Vdd) :
- 2.7V~3.6V
- Terminal Form :
- NO LEAD
- Number of Pins :
- 176
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Has ADC :
- yes
- Core Processor :
- ARM® Cortex®-M4
- DMA Channels :
- yes
- Mounting Type :
- Surface Mount
- External Data Bus Width :
- 16
- RAM Size :
- 640K x 8
- Memory Size :
- 4MB
- Datasheets
- R7FS7G27H2A01CBG#AC0
Microcontrollers Intersil (Renesas Electronics Corporation) R7FS7G27H2A01CBG#AC0 Overview
The Microcontrollers Intersil (Renesas Electronics Corporation) R7FS7G27H2A01CBG#AC0 is a high-performance 32-bit MCU designed to cater to advanced digital computing needs. Equipped with a substantial 4MB of flash memory and housed in a compact 176LFBGA package, this microcontroller is engineered to deliver robust processing capabilities and enhanced memory options suitable for complex applications. The integration of leading-edge technology into this MCU ensures reliable operation across a variety of electronic environments, making it an ideal choice for developers looking to push the boundaries of product functionality and performance.
R7FS7G27H2A01CBG#AC0 Features
This microcontroller boasts a comprehensive feature set that includes advanced security protocols to ensure data integrity and secure communications. Its high-speed processing capabilities are supported by a rich peripheral set that enhances connectivity and control options, further facilitating the development of versatile and scalable electronic systems. The integration of power management features helps to optimize energy consumption, making the device particularly well-suited for battery-operated applications.
R7FS7G27H2A01CBG#AC0 Applications
- Automotive Electronics: Utilized in engine management systems and infotainment systems to improve performance and provide superior user experiences.
- Industrial Automation: Acts as the central control unit in automated machinery, providing precise processing capabilities required for real-time system management and operational efficiency.
- Smart Home Devices: Powers a range of devices from smart thermostats to security systems, enhancing connectivity and smart functionality in home automation.
- Healthcare Equipment: Integral to the operation of medical diagnostic equipment, ensuring accurate data processing and reliability in critical healthcare environments.
- Wearable Technology: Supports the development of advanced wearable devices, offering capabilities for enhanced data collection and processing in compact form factors.
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