R7F701313EAFP-C#BA1
- Mfr.Part #
- R7F701313EAFP-C#BA1
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- 100-LQFP
- Datasheet
- Download
- Description
- IC MCU 32BIT 2MB FLASH 100LFQFP
- Stock
- 7,874
- In Stock :
- 7,874
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Microcontrollers
- Core Size :
- 32-Bit Single-Core
- Core Processor :
- RH850G3M
- EEPROM Size :
- -
- Series :
- RH850/P1M
- Package / Case :
- 100-LQFP
- Peripherals :
- LVD, POR, PWM, WDT
- Connectivity :
- CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
- Base Product Number :
- R7F701313
- RAM Size :
- 128K x 8
- Program Memory Size :
- 2MB (2M x 8)
- Mounting Type :
- Surface Mount
- Program Memory Type :
- Flash
- Package :
- Tray
- Operating Temperature :
- -
- Supplier Device Package :
- 100-LFQFP (14x14)
- Data Converters :
- A/D 24x12b
- Product Status :
- Active
- Number of I/O :
- 52
- Voltage - Supply (Vcc/Vdd) :
- 3V ~ 5.5V
- Speed :
- 160MHz
- Oscillator Type :
- Internal
- Datasheets
- R7F701313EAFP-C#BA1

Microcontrollers Intersil (Renesas Electronics Corporation) R7F701313EAFP-C#BA1 Overview
The Microcontrollers Intersil (Renesas Electronics Corporation) R7F701313EAFP-C#BA1 is a robust 32-bit microcontroller that is engineered to meet the demanding requirements of advanced embedded systems. This microcontroller integrates a powerful ARM Cortex core with 2MB of flash memory, housed in a compact 100LFQFP package, ensuring high performance and reliability. The R7F701313EAFP-C#BA1 is designed for applications requiring high-speed processing and substantial memory storage, making it an ideal choice for sophisticated control systems and smart connectivity solutions.
R7F701313EAFP-C#BA1 Features
This IC MCU features an ARM Cortex core that provides a balance of efficiency and power, capable of handling complex algorithms and processes. The 2MB flash memory offers ample space for robust applications and firmware developments, facilitating extensive programmability and flexibility. Additionally, the 100LFQFP packaging not only allows for a more streamlined board design but also enhances the thermal management capabilities of the device, which is crucial for maintaining reliability and performance in varied operating conditions.
R7F701313EAFP-C#BA1 Applications
- Automotive Control Systems: Utilized in engine management systems and advanced driver-assistance systems (ADAS) to process real-time data and control functions efficiently.
- Industrial Automation: Acts as the central processing unit within automation controllers, overseeing operational sequences, machine control, and safety protocols in manufacturing environments.
- Smart Home Devices: Provides the computational power needed to coordinate and manage various smart devices within homes, enhancing user convenience and energy efficiency.
- Internet of Things (IoT) Gateways: Used in IoT gateways to facilitate communication between connected devices and cloud services, ensuring effective data aggregation and network management.
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