R5F61664RN50FPV

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Mfr.Part #
R5F61664RN50FPV
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
144-LQFP
Datasheet
Download
Description
IC MCU 32BIT 512KB FLSH 144LFQFP
Stock
4,710
In Stock :
4,710

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Peak Reflow Temperature (Cel) :
260
Number of Terminations :
144
Supply Voltage-Max (Vsup) :
3.6V
Packaging :
Tray
Oscillator Type :
External
Data Converter :
A/D 8x10b; D/A 2x8b
Supply Current-Max :
125mA
Factory Lead Time :
20 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Program Memory Size :
512KB 512K x 8
Terminal Form :
Gull wing
Memory Size :
512kB
JESD-609 Code :
e6
Core Size :
32-Bit
Base Part Number :
R5F61664
PWM Channels :
yes
Frequency :
50MHz
RAM Size :
40K x 8
Pin Count :
144
Time@Peak Reflow Temperature-Max (s) :
20
Width :
20mm
Terminal Finish :
Tin/Bismuth (Sn/Bi)
Number of I/O :
92
DAC Channels :
yes
Number of Pins :
144
Operating Temperature :
-20°C~75°C TA
Address Bus Width :
24
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
External Data Bus Width :
16
Length :
20mm
Height Seated (Max) :
1.7mm
Core Processor :
H8SX
ROM (words) :
524288
Supply Voltage :
3.3V
Program Memory Type :
Flash
Interface :
EBI/EMI, I2C, IrDA, SCI, USB
Package / Case :
144-LQFP
Supply Voltage-Min (Vsup) :
3V
DMA Channels :
yes
Peripherals :
DMA, LVD, POR, PWM, WDT
Connectivity :
I²C, UART/USART
Bit Size :
32
Has ADC :
yes
Qualification Status :
Not Qualified
Power Supplies :
3.3V
Terminal Pitch :
0.5mm
Published :
2006
Surface Mount :
yes
Terminal Position :
QUAD
Pbfree Code :
yes
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Series :
H8® H8SX/1600
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
HTS Code :
8542.31.00.01
Datasheets
R5F61664RN50FPV
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) R5F61664RN50FPV from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:144, Base Part Number:R5F61664, Number of Pins:144, Operating Temperature:-20°C~75°C TA, Package / Case:144-LQFP, Mounting Type:Surface Mount, R5F61664RN50FPV pinout, R5F61664RN50FPV datasheet PDF, R5F61664RN50FPV amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) R5F61664RN50FPV ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) R5F61664RN50FPV


Microcontrollers Intersil (Renesas Electronics Corporation) R5F61664RN50FPV Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) R5F61664RN50FPV is a high-performance, 32-bit microcontroller designed for advanced embedded control applications. This microcontroller integrates a robust 512KB of flash memory and operates within a 144LFQFP package, making it ideal for size-sensitive and high-reliability environments. With its extensive set of peripherals and low power consumption, the R5F61664RN50FPV is engineered to meet the demands of sophisticated electronics that require multitasking capabilities and connectivity options in industrial and commercial applications.

R5F61664RN50FPV Features

The R5F61664RN50FPV boasts numerous features that enhance its functionality and usability in complex electronic systems. Key features include its 32-bit processing power, which allows for efficient handling of complex algorithms and processes. The inclusion of 512KB flash memory supports extensive program storage and data logging activities. Its package type, 144LFQFP, ensures a compact footprint while offering ample I/O options for peripheral connectivity. Additionally, the device's robust design is suitable for rugged applications, sustaining stable operation across varying environmental conditions.

R5F61664RN50FPV Applications

  • Industrial Automation: Utilized in controlling machinery and processes, enhancing operational efficiency and precision.
  • Automotive Systems: Employs in engine management and infotainment systems, providing reliability and performance in critical vehicular operations.
  • Consumer Electronics: Integrated in devices such as smart home gadgets and advanced personal electronics, delivering responsive user experiences and connectivity.
  • Communication Systems: Acts as a core component in communication infrastructure, facilitating robust data exchange and signal processing capabilities.
  • Healthcare Equipment: Applied in medical devices for monitoring and diagnostic purposes, ensuring accuracy and dependability.
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