R5F56514EDFB#30

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Mfr.Part #
R5F56514EDFB#30
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
144-LQFP
Datasheet
Download
Description
IC MCU 32BIT 512KB FLSH 144LFQFP
Stock
9,907
In Stock :
9,907

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Speed :
120MHz
Peripherals :
DMA, LVD, POR, PWM, WDT
Surface Mount :
yes
Factory Lead Time :
33 Weeks
Data Converter :
A/D 29x12b; D/A 2x12b
Operating Temperature :
-40°C~85°C TA
Series :
RX651
Oscillator Type :
Internal
Core Size :
32-Bit
Width :
6mm
Number of I/O :
111
Program Memory Size :
512KB 512K x 8
Bit Size :
32
DMA Channels :
yes
PWM Channels :
yes
Program Memory Type :
Flash
Packaging :
Tray
Address Bus Width :
24
Number of Pins :
144
Pbfree Code :
yes
Connectivity :
I²C, UART/USART
Supply Voltage :
3.3V
Supply Voltage-Min (Vsup) :
2.7V
Supply Voltage-Max (Vsup) :
3.6V
Published :
2017
Terminal Pitch :
0.5mm
RAM Size :
256K x 8
Terminal Position :
QUAD
Number of Terminations :
48
Clock Frequency :
24MHz
Terminal Form :
NO LEAD
External Data Bus Width :
16
RoHS Status :
ROHS3 Compliant
Package / Case :
144-LQFP
Voltage - Supply (Vcc/Vdd) :
2.7V~3.6V
Has ADC :
yes
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Length :
6mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Core Processor :
RXv2
Pin Count :
144
Datasheets
R5F56514EDFB#30
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) R5F56514EDFB#30 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Pins:144, Number of Terminations:48, Package / Case:144-LQFP, Mounting Type:Surface Mount, R5F56514EDFB#30 pinout, R5F56514EDFB#30 datasheet PDF, R5F56514EDFB#30 amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) R5F56514EDFB#30 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) R5F56514EDFB#30


Microcontrollers Intersil (Renesas Electronics Corporation) R5F56514EDFB#30 Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) R5F56514EDFB#30 is a cutting-edge microcontroller unit (MCU) designed to deliver high performance and reliability for demanding applications. Engineered by Renesas, a leader in semiconductor solutions, this MCU integrates a powerful 32-bit architecture and is equipped with 512KB of flash memory. Encapsulated in a 144LFQFP package, it offers a compact solution with enhanced scalability and decreased power consumption, making it ideal for advanced industrial, automotive, and communication systems. The R5F56514EDFB#30 stands out in the market for its robust design that ensures extended operational life and resilience in challenging environments.

R5F56514EDFB#30 Features

This microcontroller from Intersil (Renesas Electronics Corporation) boasts a range of features that enhance its efficiency and usability in complex electronic systems. Key features include its 32-bit processing power for high computational speed, 512KB of internal flash memory for ample storage, and a compact 144LFQFP packaging that optimizes board space. Additionally, the MCU supports multiple communication protocols, ensuring versatile connectivity options for various applications.

R5F56514EDFB#30 Applications

  • Automotive Control Systems: Utilized in engine management systems and infotainment solutions, enhancing vehicle performance and driver experience.
  • Industrial Automation: Employs in controlling machinery, robotics, and process automation, ensuring precision and reliability in production environments.
  • Smart Home Devices: Integrates into home automation products like smart thermostats and security systems, providing intelligent control and connectivity.
  • Healthcare Equipment: Applied in medical devices for monitoring and diagnostic purposes, offering reliable operation and data accuracy.
  • Consumer Electronics: Used in gadgets like portable gaming consoles and wearables, driving user interface and connectivity enhancements.
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