R5F563NECDBG#U0

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Mfr.Part #
R5F563NECDBG#U0
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
176-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 2MB FLASH 176LFBGA
Stock
629
In Stock :
629

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Program Memory Size :
2MB 2M x 8
External Data Bus Width :
32
Supply Voltage-Min (Vsup) :
2.7V
ROM (words) :
2097152
Bit Size :
32
Packaging :
Tray
Connectivity :
I²C, UART/USART
Power Supplies :
3/3.3V
Width :
13mm
On Chip Program ROM Width :
8
EEPROM Size :
32K x 8
Published :
2014
Operating Temperature :
-40°C~85°C TA
Number of I/O :
133
Pin Count :
176
Supply Current-Max :
100mA
Oscillator Type :
Internal
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Program Memory Type :
Flash
Terminal Form :
Ball
Memory Size :
2MB
RAM Size :
128K x 8
Mounting Type :
Surface Mount
Supply Voltage-Max (Vsup) :
3.6V
RoHS Status :
ROHS3 Compliant
Series :
RX600
Qualification Status :
Not Qualified
Voltage - Supply (Vcc/Vdd) :
2.7V~3.6V
RAM (bytes) :
131072
Pbfree Code :
yes
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Data Converter :
A/D 8x10b, 21x12b; D/A 2x10b
Peripherals :
DMA, LVD, POR, PWM, WDT
Number of Terminations :
176
DMA Channels :
yes
Surface Mount :
yes
PWM Channels :
yes
Height Seated (Max) :
1.4mm
Core Size :
32-Bit
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Package / Case :
176-LFBGA
Terminal Position :
BOTTOM
DAC Channels :
yes
Has ADC :
yes
Address Bus Width :
24
Frequency :
100MHz
Factory Lead Time :
20 Weeks
CPU Family :
RX
Terminal Pitch :
0.8mm
Core Processor :
RX
HTS Code :
8542.31.00.01
Number of Pins :
176
Supply Voltage :
3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Interface :
CAN, EBI/EMI, Ethernet, I2C, LIN, SCI, SPI, USB
Length :
13mm
Datasheets
R5F563NECDBG#U0
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NECDBG#U0 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Terminations:176, Package / Case:176-LFBGA, Number of Pins:176, R5F563NECDBG#U0 pinout, R5F563NECDBG#U0 datasheet PDF, R5F563NECDBG#U0 amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NECDBG#U0 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) R5F563NECDBG#U0


Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NECDBG#U0 Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) R5F563NECDBG#U0 is a highly advanced 32-bit microcontroller unit (MCU) designed for demanding applications that require high-speed processing and substantial memory. It features 2MB of flash memory and a 176-LFBGA package, making it highly adaptable for sophisticated electronic environments. This MCU is perfect for developers looking for reliable, high-performance components capable of handling complex algorithms and multiple tasks simultaneously. The integration of advanced control features and connectivity options makes the R5F563NECDBG#U0 an ideal choice for a wide range of industrial and commercial applications.

R5F563NECDBG#U0 Features

The R5F563NECDBG#U0 microcontroller boasts an impressive array of features including a 32-bit CPU for efficient processing, 2MB of integrated flash memory for robust data storage, and a 176-LFBGA package for reduced space usage on PCBs. Its high-speed capabilities are suited for intensive computational tasks, while its low power consumption ensures efficiency in energy-sensitive applications.

R5F563NECDBG#U0 Applications

  • Automotive Control Systems: Utilized in engine management and automotive sensor applications, enhancing performance through precise control and real-time data processing.
  • Industrial Automation: Empowers complex machinery control, contributing to automation efficiency in manufacturing processes with its high-speed processing capabilities.
  • Consumer Electronics: Integral in smart home devices and advanced wearables, where its capacity to handle multiple tasks simultaneously and efficiently is crucial.
  • Healthcare Devices: Used in medical diagnostic equipment, improving patient care through fast and reliable processing of complex diagnostic data.
  • Telecommunications: Supports telecommunications infrastructure by managing signal processing tasks and data flow control, ensuring robust and efficient communication networks.
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