R5F562TADDFF#V3

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Mfr.Part #
R5F562TADDFF#V3
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
80-LQFP
Datasheet
Download
Description
IC MCU 32BIT 256KB FLASH 80LQFP
Stock
32,947
In Stock :
32,947

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
RoHS Status :
ROHS3 Compliant
Number of Pins :
80
Interface :
I2C, LIN, SCI, SPI
Number of Terminations :
80
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Program Memory Type :
Flash
Terminal Pitch :
0.65mm
Terminal Position :
QUAD
DMA Channels :
yes
Series :
RX600
Bit Size :
32
Connectivity :
I²C, UART/USART
Supply Voltage-Min (Vsup) :
4V
RAM Size :
16K x 8
Surface Mount :
yes
Program Memory Size :
256KB 256K x 8
Frequency :
100MHz
Factory Lead Time :
20 Weeks
Core Size :
32-Bit
Mounting Type :
Surface Mount
Published :
2014
Packaging :
Tray
Terminal Form :
Gull wing
Supply Voltage-Max (Vsup) :
5.5V
Pin Count :
80
Peripherals :
DMA, LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd) :
4V~5.5V
Width :
14mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
256KB
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Core Processor :
RX
Supply Voltage :
5V
Length :
14mm
Pbfree Code :
yes
PWM Channels :
yes
HTS Code :
8542.31.00.01
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of I/O :
44
Operating Temperature :
-40°C~85°C TA
Has ADC :
yes
Oscillator Type :
Internal
Package / Case :
80-LQFP
Data Converter :
A/D 4x10b, 8x12b
Datasheets
R5F562TADDFF#V3
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) R5F562TADDFF#V3 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:80, Number of Terminations:80, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Package / Case:80-LQFP, R5F562TADDFF#V3 pinout, R5F562TADDFF#V3 datasheet PDF, R5F562TADDFF#V3 amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) R5F562TADDFF#V3 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) R5F562TADDFF#V3


Microcontrollers Intersil (Renesas Electronics Corporation) R5F562TADDFF#V3 Overview

The Microcontrollers Intersil (Renesas Electronics Corporation) R5F562TADDFF#V3 is a powerful microcontroller unit (MCU) designed to cater to sophisticated embedded applications requiring high performance, flexibility, and reliability. Equipped with a 32-bit architecture and 256KB of flash memory, this MCU is housed in an 80LQFP package, optimizing board space while ensuring ample functionality. Ideal for applications demanding intricate processing capabilities and low power consumption, the R5F562TADDFF#V3 offers a robust solution for developers looking to push the boundaries of innovation in their product designs.

R5F562TADDFF#V3 Features

This microcontroller boasts a high-performance 32-bit CPU, enhancing computational speed and efficiency. The 256KB flash memory facilitates extensive program storage and efficient data management. The 80LQFP packaging not only makes it compact but also enables better thermal management and reduces electromagnetic interference, crucial for consistent performance in sensitive applications.

R5F562TADDFF#V3 Applications

  • Automotive Control Systems: Integrates into engine management systems and body control modules, improving vehicle performance and safety through enhanced computing capabilities.
  • Industrial Automation: Drives complex machinery and production processes, offering precise control and reliability for critical operations.
  • Home Automation Systems: Powers smart home devices, providing the computational power needed for advanced features like automated lighting, security, and HVAC systems.
  • Healthcare Devices: Utilized in medical monitoring systems to process real-time data and enhance the reliability of healthcare equipment.
  • Consumer Electronics: Serves as the core processor in gadgets such as gaming consoles and smart appliances, supporting rich user interfaces and connectivity.
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