PIC32MZ1024EFH144-E/JWX
- Mfr.Part #
- PIC32MZ1024EFH144-E/JWX
- Manufacturer
- Microchip Technology
- Package / Case
- 144-TFBGA
- Datasheet
- Download
- Description
- IC MCU 32BIT 1MB FLASH 144TFBGA
- Stock
- 30,513
- In Stock :
- 30,513
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Core Size :
- 32-Bit
- Program Memory Type :
- Flash
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Data Bus Width :
- 32 bit
- Surface Mount :
- yes
- Subcategory :
- Microcontrollers - MCU
- Product Category :
- 32-bit Microcontrollers - MCU
- Terminal Position :
- BOTTOM
- Supply Voltage-Max (Vsup) :
- 3.6V
- Terminal Pitch :
- 0.5mm
- Supplier Device Package :
- 144-TFBGA (7x7)
- Terminal Form :
- BUTT
- Brand :
- Microchip Technology
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
- Mounting Style :
- SMD/SMT
- RAM Size :
- 512K x 8
- Program Memory Size :
- 1MB 1M x 8
- Base Part Number :
- PIC32MZ1024EFH
- Clock Frequency :
- 64MHz
- Reach Compliance Code :
- Unknown
- Supply Voltage-Min (Vsup) :
- 2.1V
- Has ADC :
- yes
- Speed :
- 180MHz
- Bit Size :
- 32
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER
- Minimum Operating Temperature :
- - 40 C
- EEPROM Size :
- -
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply (Vcc/Vdd) :
- 2.1V~3.6V
- Number of I/O :
- 120
- Base Product Number :
- PIC32MZ1024EFH144
- Interface Type :
- CAN, I2C, SPI, SQI, UART
- Core Processor :
- MIPS32® M-Class
- Number of I/Os :
- 120 I/O
- Operating Temperature :
- -40°C~125°C TA
- JESD-30 Code :
- S-PBGA-B144
- Data Converters :
- A/D 48x12b
- Height Seated (Max) :
- 1.02mm
- Factory Lead Time :
- 12 Weeks
- On Chip Program ROM Width :
- 8
- Packaging :
- Tray
- Number of Terminations :
- 144
- Mounting Type :
- Surface Mount
- Maximum Operating Temperature :
- + 125 C
- Supply Voltage :
- 3.3V
- Tradename :
- MIPS32
- Screening Level :
- AEC-Q100; TS 16949
- RoHS :
- Details
- Data Converter :
- A/D 48x12b
- Number of ADC Channels :
- 48 Channel
- DAC Channels :
- No
- Peripherals :
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Series :
- Automotive, AEC-Q100, PIC® 32MZ
- Package / Case :
- 144-TFBGA
- Oscillator Type :
- Internal
- Length :
- 7mm
- Product :
- MCU
- Width :
- 7mm
- Manufacturer :
- Microchip
- Product Status :
- Active
- PWM Channels :
- yes
- DMA Channels :
- yes
- Product Type :
- 32-bit Microcontrollers - MCU
- Qualification :
- AEC-Q100
- Package :
- Tray
- Datasheets
- PIC32MZ1024EFH144-E/JWX
PIC32MZ1024EFH144-E/JWX Documents

Microcontrollers Microchip Technology PIC32MZ1024EFH144-E/JWX Overview
The Microcontrollers Microchip Technology PIC32MZ1024EFH144-E/JWX is a high-performance microcontroller unit (MCU) designed to meet the rigorous demands of sophisticated embedded applications. Manufactured by Microchip Technology, this MCU integrates advanced features and extensive memory capabilities within a compact 144TFBGA package, making it ideal for complex yet space-constrained applications. Its 1MB of flash memory and 32-bit architecture ensure efficient handling of extensive codebases and real-time processing requirements, offering developers a robust platform for innovation and advanced system design.
PIC32MZ1024EFH144-E/JWX Features
- 32-bit MIPS M-Class processor
- 1MB of flash memory
- High-performance digital signal processing
- Low-power management modes
- 144-pin TFBGA package
- Extensive peripheral set for enhanced connectivity and interfacing
PIC32MZ1024EFH144-E/JWX Applications
- Automotive systems: Utilized in engine control units and infotainment systems, providing robust processing capabilities.
- Consumer electronics: Powers advanced user interfaces in smart appliances and home automation systems.
- Industrial automation: Integral in managing control systems and complex machinery operations due to its reliable and high-speed processing.
- Medical devices: Used in medical monitoring systems requiring precise and reliable data processing capabilities.
- Internet of Things (IoT) devices: Serves as the core processor for IoT hubs, enhancing connectivity and data throughput in smart systems.
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