PIC32MX170F256B-50I/SP

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Mfr.Part #
PIC32MX170F256B-50I/SP
Manufacturer
Microchip Technology
Package / Case
28-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC MCU 32BIT 256KB FLASH 28SPDIP
Stock
15
In Stock :
15

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Supplier Device Package :
28-SPDIP
Number of ADC Channels :
10
Minimum Operating Temperature :
-40 °C
Package Type :
SPDIP
Weight :
4.190003g
Operating Supply Voltage (Min) :
2.3(V)
Peripherals :
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Maximum Expanded Memory Size :
4GB
Subcategory :
Microcontrollers - MCU
Base Product Number :
PIC32MX170
EEPROM Size :
--
Brand :
Microchip Technology / Atmel
Base Part Number :
PIC32MX170F256B
Number of SPI Channels :
2
Family Name :
PIC32MX
Speed :
50MHz
Mounting :
Through Hole
Operating Supply Voltage (Typ) :
2.5/3.3(V)
Operating Temperature (Min) :
-40C
RAM Size :
64K x 8
Frequency :
50MHz
Data Converters :
A/D 10x10b
Rad Hardened :
No
Programmable :
yes
Number of I/O :
21
Supply Voltage :
3.3V
Pin Count :
28
Interfaces :
I2C/I2S/SPI/UART
Voltage - Supply (Vcc/Vdd) :
2.3V~3.6V
Length :
35.56mm
Product Category :
32-bit Microcontrollers - MCU
Number of Pins :
28
Package / Case :
28-DIP (0.300, 7.62mm)
Package :
Tube
Program Memory Size :
256KB 256K x 8
DMA Channels :
yes
Dimensions :
1.4 x 0.295 x 0.15in
Data Bus Width :
32b
Operating Temperature :
-40°C~85°C TA
Number of I/Os :
21 I/O
Number of UART Channels :
2
Mounting Type :
Through Hole
REACH SVHC :
No SVHC
Number of I2C Channels :
2
Operating Supply Voltage (Max) :
3.6(V)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Program Memory Type :
Flash
Device Core Size :
32(b)
Has ADC :
yes
Operating Temperature Classification :
Industrial
Product Type :
32-bit Microcontrollers - MCU
Oscillator Type :
Internal
Maximum Operating Temperature :
+85 °C
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Mounting Style :
Through Hole
Series :
PIC® 32MX
Watchdog Timer :
yes
Width :
7.493mm
Core Size :
32-Bit
Operating Temp Range :
-40C to 85C
RoHS :
Details
Interface :
I2C, I2S, IrDA, LIN, SPI, UART, USART, USB
Terminal Finish :
Matte Tin (Sn) - annealed
Factory Lead Time :
6 Weeks
Packaging :
Tube
Mount :
Through Hole
Manufacturer :
Microchip
Terminal Position :
Dual
Core Architecture :
PIC
Connectivity :
I2C, IrDA, LINbus, SPI, UART/USART
PWM Channels :
yes
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Clock Freq :
50(MHz)
Data Converter :
A/D 10x10b
JESD-609 Code :
e3
Typical Operating Supply Voltage :
2.3 → 3.6 V
Tradename :
MIPS32
Instruction Set Architecture :
RISC
Total Internal Ram Size :
64KB(kB)
Operating Temperature (Max) :
85C
Number of Timers - General Purpose :
5
# I/Os (Max) :
21
Bit Size :
32
Number of Timers/Counters :
5
Interface Type :
I2C/I2S/SPI/UART
Core Processor :
MIPS32® M4K™
Published :
2011
Screening Level :
TS 16949
Memory Size :
256KB
Product Status :
Active
Device Core :
MIPS32 M4K
Supply Voltage-Max (Vsup) :
3.6V
MSL :
MSL 1 - Unlimited
Height :
3.81mm
RoHS Status :
ROHS3 Compliant
Number of Terminations :
28
Number of Ethernet Channels :
0
Moisture Sensitivity Level (MSL) :
Not Applicable
Introducing Microcontrollers Microchip Technology PIC32MX170F256B-50I/SP from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:PIC32MX170F256B, Number of Pins:28, Package / Case:28-DIP (0.300, 7.62mm), Operating Temperature:-40°C~85°C TA, Mounting Type:Through Hole, Number of Terminations:28, PIC32MX170F256B-50I/SP pinout, PIC32MX170F256B-50I/SP datasheet PDF, PIC32MX170F256B-50I/SP amp .Beyond Microcontrollers Microchip Technology PIC32MX170F256B-50I/SP ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC32MX170F256B-50I/SP


Microcontrollers Microchip Technology PIC32MX170F256B-50I/SP Overview

The Microcontrollers Microchip Technology PIC32MX170F256B-50I/SP, designed by industry leader Microchip Technology, is a powerful and versatile 32-bit microcontroller unit (MCU). This device encapsulates high-performance computing in a small 28SPDIP package, making it ideal for applications requiring compact yet robust control systems. With 256KB of flash memory, it offers ample space for complex software applications and algorithms, ensuring smooth and efficient operation in demanding environments. Its suitability for scalable projects from prototyping to mass production makes it a go-to choice for developers and engineers looking to harness powerful processing capabilities in their designs.

PIC32MX170F256B-50I/SP Features

This MCU stands out with its 32-bit architecture, providing the computational power necessary for intricate processing and multitasking. Its 256KB flash memory is perfect for storing large applications while facilitating quick and reliable read-access. Additionally, the PIC32MX170F256B-50I/SP operates at up to 50 MHz, offering a balanced approach to power consumption and processing speed. The packaging in a 28SPDIP format ensures compatibility with standard PCB layouts, simplifying the integration process into existing designs.

PIC32MX170F256B-50I/SP Applications

  • Industrial Automation: Utilized in controlling machinery and process lines, where its robust processing capabilities ensure reliable and precise control.
  • Smart Home Devices: Powers a range of smart devices, providing the brain for automation and connectivity that enhances user experience and functionality.
  • Automotive Applications: Applied in automotive systems for enhanced navigation and diagnostic systems, supporting safety and efficiency on the road.
  • Consumer Electronics: Ideal for high-demand consumer electronics, such as gaming consoles and advanced wearables, where performance and footprint are critical.
  • Internet of Things (IoT): Acts as a core component in IoT devices, managing data communication and processing to drive innovative, connected solutions.
This description emphasizes the product's utility in various high-demand applications, aiming to attract B2B customers through its detailed yet clear presentation of features and potential uses.
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