PIC18LF26K80-I/SS

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Mfr.Part #
PIC18LF26K80-I/SS
Manufacturer
Microchip Technology
Package / Case
28-SSOP (0.209, 5.30mm Width)
Datasheet
Download
Description
IC MCU 8BIT 64KB FLASH 28SSOP
Stock
5,226
In Stock :
5,226

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Connectivity :
ECANbus, I2C, LINbus, SPI, UART/USART
Package / Case :
28-SSOP (0.209, 5.30mm Width)
Interface :
CAN, I2C, LIN, SPI, UART, USART
Product Type :
8-bit Microcontrollers - MCU
Terminal Finish :
Matte Tin (Sn) - annealed
Bit Size :
8
Oscillator Type :
Internal
Mounting Style :
SMD/SMT
Program Memory Type :
Flash
Number of I2C Channels :
1
Operating Temperature :
-40°C~85°C TA
Data Bus Width :
8B
Supply Voltage-Min (Vsup) :
3V
Number of A/D Converters :
1
Base Product Number :
PIC18LF26
Pbfree Code :
yes
Pin Count :
28
Package :
Tube
Program Memory Size :
64KB 32K x 16
Series :
PIC® XLP™ 18K
Product Category :
8-bit Microcontrollers - MCU
REACH SVHC :
No SVHC
EEPROM Size :
1K x 8
Packaging :
Tube
Tradename :
PIC
Number of Pins :
28
Manufacturer :
Microchip
Voltage - Supply (Vcc/Vdd) :
1.8V~3.6V
Length :
10.2mm
Data Converters :
A/D 8x12b
Number of Terminations :
28
RoHS Status :
ROHS3 Compliant
Supply Voltage :
3.3V
Lifecycle Status :
Production (Last Updated: 2 years ago)
Number of SPI Channels :
1
RoHS :
Compliant
Published :
2010
Max Power Dissipation :
1W
Max Operating Temperature :
85 °C
Core Size :
8-Bit
Number of UART Channels :
2
Has ADC :
yes
Supplier Device Package :
28-SSOP
Product Status :
Active
Peripherals :
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Brand :
Microchip Technology / Atmel
Device Core :
PIC
Mounting Type :
Surface Mount
Maximum Operating Temperature :
+ 85 C
Number of ADC Channels :
8
DMA Channels :
No
Lead Free :
Lead Free
Interface Type :
I2C, SPI, USART
Data Converter :
A/D 8x12b
Schedule B :
8542310000
Speed :
64MHz
Minimum Operating Temperature :
- 40 C
Surface Mount :
yes
Number of I/Os :
24
Min Operating Temperature :
-40 °C
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Terminal Form :
Gull wing
Time@Peak Reflow Temperature-Max (s) :
40
CPU Family :
PIC
RAM Size :
3.6K x 8
Number of PWM Channels :
5
Peak Reflow Temperature (Cel) :
260
Frequency :
64MHz
Height :
1.75mm
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Max Supply Voltage :
3.6 V
JESD-609 Code :
e3
Supply Voltage-Max (Vsup) :
3.6V
Number of Timers/Counters :
5
Radiation Hardening :
No
Watchdog Timer :
yes
Terminal Position :
Dual
Memory Type :
Flash
Number of I/O :
24
Factory Lead Time :
9 Weeks
Min Supply Voltage :
1.8 V
Core Processor :
PIC
Number of Bits :
8
Memory Size :
64KB
Number of Programmable I/O :
24
Max Frequency :
64 MHz
Interfaces :
CAN/I2C/SPI/USART
Width :
5.3mm
Base Part Number :
PIC18LF26K80
Core Architecture :
PIC
Datasheets
PIC18LF26K80-I/SS
Introducing Microcontrollers Microchip Technology PIC18LF26K80-I/SS from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:28-SSOP (0.209, 5.30mm Width), Operating Temperature:-40°C~85°C TA, Number of Pins:28, Number of Terminations:28, Mounting Type:Surface Mount, Base Part Number:PIC18LF26K80, PIC18LF26K80-I/SS pinout, PIC18LF26K80-I/SS datasheet PDF, PIC18LF26K80-I/SS amp .Beyond Microcontrollers Microchip Technology PIC18LF26K80-I/SS ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC18LF26K80-I/SS


Microcontrollers+Microchip Technology+PIC18LF26K80-I/SS Overview

PIC18LF26K80-I/SS是由Microchip Technology制造的一款高性能8位微控制器,具有64KB的闪存容量和28SSOP封装。这个微控制器非常适合各种工业和消费电子应用,因其低功耗和广泛的温度范围,能够在严苛的环境中保持稳定运行。它具有丰富的外围设备接口和灵活的编程选项,为设计人员提供了极大的设计自由度。其内置的模拟和数字功能使其成为工业控制、自动化系统以及通信设备等领域的理想选择。对于批量生产的企业客户而言,Microcontrollers+Microchip Technology+PIC18LF26K80-I/SS提供了可靠的性能和高度的灵活性。

PIC18LF26K80-I/SS Features

- 64KB闪存容量:提供充足的存储空间,用于复杂的代码和数据。 - 28SSOP封装:节省空间的设计,适用于紧凑的设备。 - 低功耗:适用于电池供电的应用,延长设备续航。 - 宽温度范围:确保在极端环境下稳定运行。 - 丰富的外围设备接口:支持多种通信和控制需求。 - 内置模拟和数字功能:满足多样化的设计要求。

PIC18LF26K80-I/SS Applications

- 工业控制系统:PIC18LF26K80-I/SS能够在工业环境中稳定运行,用于控制设备和监测系统。 - 自动化系统:凭借其丰富的外围设备接口,适用于自动化装置的控制与管理。 - 通信设备:低功耗特性使其适用于通信模块,延长电池寿命。 - 医疗设备:在医疗设备中,宽温度范围确保了在多种环境中的可靠性。 - 智能家居:丰富的功能和紧凑的封装,非常适合嵌入式智能家居设备。
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