PIC18LF26K40-E/SO

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Mfr.Part #
PIC18LF26K40-E/SO
Manufacturer
Microchip Technology
Package / Case
28-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MCU 8BIT 64KB FLASH 28SOIC
Stock
32,306
In Stock :
32,306

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
DMA Channels :
No
Number of External Interrupts :
3
Length :
17.9mm
Terminal Form :
Gull wing
Boundary Scan :
No
Supplier Device Package :
28-SOIC
RAM Size :
3.6K x 8
Package :
Tube
Additional Feature :
IT ALSO OPERATES AT 2.5V MIN AT 32 MHZ AND 1.8V MIN AT 16 MHZ
Number of I/O :
25
Peripherals :
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Base Part Number :
PIC18LF26K40
Clock Frequency :
64MHz
Core Size :
8-Bit
Supply Voltage :
3.3V
Base Product Number :
PIC18LF26
Has ADC :
yes
Subcategory :
Microcontrollers - MCU
Height Seated (Max) :
2.65mm
Supply Voltage-Max (Vsup) :
3.6V
Terminal Position :
Dual
RAM (words) :
32768
Core Processor :
PIC
Bit Size :
8
Factory Lead Time :
6 Weeks
Screening Level :
TS 16949
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Program Memory Type :
Flash
Tradename :
PIC
Format :
FIXED POINT
RoHS :
Details
HTS Code :
8542.31.00.01
Speed :
64MHz
Number of Terminations :
28
Operating Temperature :
-40°C~125°C TA
Low Power Mode :
yes
Data Converter :
A/D 24x10b; D/A 1x5b
Product Status :
Active
Package / Case :
28-SOIC (0.295, 7.50mm Width)
Product Category :
8-bit Microcontrollers - MCU
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Mounting Type :
Surface Mount
Oscillator Type :
Internal
EEPROM Size :
1K x 8
DAC Channels :
yes
Voltage - Supply (Vcc/Vdd) :
1.8V~3.6V
Connectivity :
I2C, LINbus, SPI, UART/USART
Surface Mount :
yes
Supply Voltage-Min (Vsup) :
3V
On Chip Program ROM Width :
16
Integrated Cache :
No
Product Type :
8-bit Microcontrollers - MCU
Peak Reflow Temperature (Cel) :
260
Number of Timers :
9
Terminal Pitch :
1.27mm
Brand :
Microchip Technology
Manufacturer :
Microchip
JESD-30 Code :
R-PDSO-G28
Width :
7.5mm
PWM Channels :
yes
Data Converters :
A/D 24x10b, D/A 1x5b
Series :
PIC® XLP™ 18K
Program Memory Size :
64KB 32K x 16
Published :
2017
Packaging :
Tube
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
ROHS3 Compliant
Datasheets
PIC18LF26K40-E/SO
Introducing Microcontrollers Microchip Technology PIC18LF26K40-E/SO from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:PIC18LF26K40, Number of Terminations:28, Operating Temperature:-40°C~125°C TA, Package / Case:28-SOIC (0.295, 7.50mm Width), Mounting Type:Surface Mount, PIC18LF26K40-E/SO pinout, PIC18LF26K40-E/SO datasheet PDF, PIC18LF26K40-E/SO amp .Beyond Microcontrollers Microchip Technology PIC18LF26K40-E/SO ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC18LF26K40-E/SO


Microcontrollers Microchip Technology PIC18LF26K40-E/SO Overview

The Microcontrollers Microchip Technology PIC18LF26K40-E/SO is a high-performance microcontroller unit (MCU) designed by Microchip Technology. It features an 8-bit architecture and is well-suited for advanced applications requiring robust operation in varied environments. This MCU is crafted in a 28SOIC package, integrating a powerful 64KB of flash memory, which allows for ample storage of application code and data. The flexibility and capabilities of the PIC18LF26K40-E/SO make it an ideal choice for designers focusing on automation, sensing, and communication in their projects, driving efficiency and innovation.

PIC18LF26K40-E/SO Features

This MCU is equipped with numerous features that enhance its performance in complex electronic environments:

  • High endurance 64KB flash memory.
  • Extended voltage range for versatile power supply scenarios.
  • Comprehensive set of peripherals including ADC, CCP, and multiple communication interfaces.
  • Low power consumption with power-managed modes for energy efficiency.
  • Ease of programmability and compatibility with MPLAB X IDE.

PIC18LF26K40-E/SO Applications

  • Industrial Automation: Utilized in control systems for sensors and actuators, enhancing process efficiency and reliability.
  • Consumer Electronics: Drives the operation of smart appliances, offering connectivity and intelligent control capabilities.
  • Automotive: Integrated into automotive subsystems for monitoring and control applications, contributing to safer and smarter vehicle operations.
  • Healthcare Devices: Serves in medical monitoring equipment, providing dependable computing power and data handling capabilities for critical healthcare operations.
  • Telecommunication: Employed in communication infrastructure, facilitating robust data transmission and signal processing tasks.
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