PIC18LF25K50-E/SO

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Mfr.Part #
PIC18LF25K50-E/SO
Manufacturer
Microchip Technology
Package / Case
28-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MCU 8BIT 32KB FLASH 28SOIC
Stock
1,201
In Stock :
1,201

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Series :
PIC® XLP™ 18K
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Published :
2012
Additional Feature :
IT ALSO OPERATES IN 4MHZ AT 1.8V MIN SUPPLY
DMA Channels :
No
Mounting Type :
Surface Mount
Package :
Tube
Data Converters :
A/D 14x10b
DAC Channels :
yes
Terminal Pitch :
1.27mm
Program Memory Size :
32KB 16K x 16
Has ADC :
yes
ECCN Code :
3A001.A.3
Height Seated (Max) :
2.65mm
Core Processor :
PIC
Supplier Device Package :
28-SOIC
Number of Terminations :
28
Supply Voltage-Min (Vsup) :
2.7V
Program Memory Type :
Flash
Connectivity :
I2C, SPI, UART/USART, USB
Bit Size :
8
Terminal Form :
Gull wing
ROM (words) :
16384
Operating Temperature :
-40°C~125°C TA
Peak Reflow Temperature (Cel) :
250
Package / Case :
28-SOIC (0.295, 7.50mm Width)
Surface Mount :
yes
Width :
7.5mm
EEPROM Size :
256 x 8
Terminal Finish :
Matte Tin (Sn)
JESD-609 Code :
e3
Base Part Number :
PIC18LF25K50
Product Status :
Active
Time@Peak Reflow Temperature-Max (s) :
40
Data Converter :
A/D 14x10b
Oscillator Type :
Internal
Interface :
I2C, SPI, UART, USART, USB
Factory Lead Time :
6 Weeks
JESD-30 Code :
R-PDSO-G28
Number of I/O :
25
On Chip Program ROM Width :
16
RoHS Status :
ROHS3 Compliant
PWM Channels :
yes
Peripherals :
Brown-out Detect/Reset, POR, PWM, WDT
Base Product Number :
PIC18LF25
HTS Code :
8542.31.00.01
Core Size :
8-Bit
Supply Voltage :
3V
Terminal Position :
Dual
Supply Voltage-Max (Vsup) :
3.6V
Speed :
48MHz
Frequency :
48MHz
RAM Size :
2K x 8
Voltage - Supply (Vcc/Vdd) :
1.8V~3.6V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Packaging :
Tube
Length :
17.9mm
Introducing Microcontrollers Microchip Technology PIC18LF25K50-E/SO from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:28, Operating Temperature:-40°C~125°C TA, Package / Case:28-SOIC (0.295, 7.50mm Width), Base Part Number:PIC18LF25K50, PIC18LF25K50-E/SO pinout, PIC18LF25K50-E/SO datasheet PDF, PIC18LF25K50-E/SO amp .Beyond Microcontrollers Microchip Technology PIC18LF25K50-E/SO ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC18LF25K50-E/SO


Microcontrollers Microchip Technology PIC18LF25K50-E/SO Overview

Discover the Microcontrollers Microchip Technology PIC18LF25K50-E/SO, a robust 8-bit microcontroller designed to deliver exceptional performance and adaptability. Engineered by Microchip Technology, this MCU is an ideal solution for developers needing high computational power and minimal power consumption in a compact form factor. The PIC18LF25K50-E/SO stands out for its sophisticated integration of 32KB flash memory within a 28SOIC package, ensuring ample space for complex applications while maintaining a streamlined design. Its versatility is suitable for a broad range of applications, from advanced consumer electronics to industrial automation systems, making it a prime choice for businesses looking to scale their operations efficiently.

PIC18LF25K50-E/SO Features

This microcontroller integrates multiple features that enhance its efficiency and ease of use. Key features include its 32KB of flash memory, extensive interface support with USB, I2C, SPI, and USART, which provide excellent connectivity options. Additionally, the device supports enhanced power management techniques which are crucial for low-power applications. Its 10-bit, 12-channel ADC adds a fine degree of sensor interfacing capability, further broadening its utility in complex digital environments.

PIC18LF25K50-E/SO Applications

  • Consumer Electronics: Utilized in devices such as smart home gadgets and advanced personal entertainment systems, where its USB connectivity and ample memory support sophisticated user interfaces and connectivity features.
  • Industrial Automation: Acts as a control node in automated production lines, leveraging its robust I/O capabilities and ADC for process monitoring and control.
  • Automotive Applications: Integrated into automotive subsystems for monitoring and control processes, where reliability and endurance are critical.
  • Medical Devices: Employed in patient monitoring systems and handheld medical instruments, benefiting from its low power consumption and high data integrity.
  • Telecommunication: Used in communication infrastructure equipment, facilitating data transmission and signal processing capabilities essential for modern telecommunication technologies.
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