PIC18LF24J50-I/SP

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Mfr.Part #
PIC18LF24J50-I/SP
Manufacturer
Microchip Technology
Package / Case
28-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC MCU 8BIT 16KB FLASH 28SPDIP
Stock
224
In Stock :
224

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Interfaces :
I2C/SPI/USART/USB
Oscillator Type :
Internal
Number of Timers/Counters :
5
Mounting Type :
Through Hole
Number of Pins :
28
Program Memory Type :
Flash
Product Status :
Active
RoHS Status :
ROHS3 Compliant
Series :
PIC® XLP™ 18J
Pbfree Code :
yes
Device Core :
PIC
EEPROM Size :
--
Operating Temperature :
-40°C~85°C TA
Width :
7.493mm
Data Converter :
A/D 10x10b
Program Memory Size :
16KB 8K x 16
ECCN Code :
EAR99
Radiation Hardening :
No
REACH SVHC :
No SVHC
Number of I/O :
16
RAM Size :
3.8K x 8
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Data Converters :
A/D 10x10b
Terminal Finish :
MATTE TIN
Interface :
I2C, SPI, UART, USART, USB
Peripherals :
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of ADC Channels :
10
Memory Size :
16kB
Termination :
Through Hole
Density :
128 kb
Core Processor :
PIC
Supply Voltage :
2.5V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Package :
Tube
Watchdog Timer :
yes
Published :
2009
Terminal Position :
Dual
Base Part Number :
PIC18LF24J50
Base Product Number :
PIC18LF24J50
Length :
35.56mm
PWM Channels :
yes
Package / Case :
28-DIP (0.300, 7.62mm)
Data Bus Width :
8B
Frequency :
48MHz
Core Size :
8-Bit
Packaging :
Tube
Number of SPI Channels :
2
DMA Channels :
yes
Voltage - Supply (Vcc/Vdd) :
2V~3.6V
Connectivity :
I2C, SPI, UART/USART, USB
CPU Family :
PIC
Factory Lead Time :
5 Weeks
Supplier Device Package :
28-SPDIP
Has ADC :
yes
Bit Size :
8
Speed :
48MHz
Mount :
Through Hole
Height :
3.81mm
Pin Count :
28
Number of Terminations :
28
JESD-609 Code :
e3
Max Power Dissipation :
1W
Datasheets
PIC18LF24J50-I/SP
Introducing Microcontrollers Microchip Technology PIC18LF24J50-I/SP from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Number of Pins:28, Operating Temperature:-40°C~85°C TA, Base Part Number:PIC18LF24J50, Package / Case:28-DIP (0.300, 7.62mm), Number of Terminations:28, PIC18LF24J50-I/SP pinout, PIC18LF24J50-I/SP datasheet PDF, PIC18LF24J50-I/SP amp .Beyond Microcontrollers Microchip Technology PIC18LF24J50-I/SP ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC18LF24J50-I/SP


Microcontrollers Microchip Technology PIC18LF24J50-I/SP Overview

The Microcontrollers Microchip Technology PIC18LF24J50-I/SP is a robust 8-bit microcontroller from Microchip Technology, designed to cater to sophisticated control applications where efficiency and reliability are crucial. This device integrates 16KB of flash memory, providing substantial room for application code and data storage which is vital for complex programming environments. The PIC18LF24J50-I/SP operates in a 28SPDIP package, making it easy to integrate into both prototyping settings and final product designs. Its versatility and high performance make it suitable for a wide array of industrial and commercial applications.

PIC18LF24J50-I/SP Features

  • 8-bit microcontroller with a powerful PIC architecture.
  • 16KB flash memory for robust data management and application storage.
  • Low power consumption suitable for battery-operated devices.
  • Extended temperature range, ensuring reliability under varying environmental conditions.
  • Full-speed USB 2.0 interface for seamless communication and firmware updates.
  • Highly flexible oscillator structure to support a wide range of frequency needs.

PIC18LF24J50-I/SP Applications

  • Consumer Electronics: Utilized in smart home devices for enhanced connectivity and control.
  • Industrial Automation: Integrates into monitoring systems for real-time process control and diagnostics.
  • Automotive: Serves in vehicle management systems to enhance operational efficiency and safety features.
  • Medical Devices: Employs in portable medical diagnostics equipment, supporting complex functionalities with reliability.
  • Communication Equipment: Used in communication infrastructure to facilitate robust and reliable data exchange.
  • Building Management Systems: Helps in automation and energy management of large buildings for optimized operations.
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