PIC17LC752-08I/L
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- Mfr.Part #
- PIC17LC752-08I/L
- Manufacturer
- Microchip Technology
- Package / Case
- 68-LCC (J-Lead)
- Datasheet
- Download
- Description
- IC MCU 8BIT 16KB OTP 68PLCC
- Stock
- 41,764
- In Stock ：
- 41,764
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Factory Lead Time :
- 12 Weeks
- Length :
- 24.3078mm
- Number of PWM Channels :
- 3
- DMA Channels :
- No
- Mounting Type :
- Surface Mount
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Interfaces :
- I2C/SPI/USART
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 5V
- Memory Type :
- EPROM, OTP
- Published :
- 2000
- Data Bus Width :
- 8B
- Voltage - Supply (Vcc/Vdd) :
- 3V~5.5V
- Operating Temperature :
- -40°C~85°C TA
- Bit Size :
- 8
- ECCN Code :
- EAR99
- Number of Pins :
- 68
- Supply Voltage-Max (Vsup) :
- 6V
- Watchdog Timer :
- yes
- Oscillator Type :
- External
- Lead Free :
- Lead Free
- Max Power Dissipation :
- 1W
- Package :
- Tube
- Device Core :
- PIC
- Number of Bits :
- 8
- Terminal Finish :
- Matte Tin (Sn)
- Access Time :
- 8 μs
- Number of I/O :
- 50
- Has ADC :
- yes
- Base Part Number :
- PIC17LC752
- Height :
- 4.572mm
- Product Status :
- Active
- Mount :
- Surface Mount
- Speed :
- 8MHz
- EEPROM Size :
- --
- CPU Family :
- PIC
- Number of A/D Converters :
- 1
- Number of ADC Channels :
- 12
- Series :
- PIC® 17C
- Number of Terminations :
- 68
- Program Memory Type :
- OTP
- Radiation Hardening :
- No
- JESD-609 Code :
- e3
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Frequency :
- 8MHz
- Pbfree Code :
- yes
- RAM Size :
- 678 x 8
- Interface :
- I2C, RS-232, SCI, SPI, UART, USART
- Peak Reflow Temperature (Cel) :
- 245
- Terminal Form :
- J BEND
- Data Converter :
- A/D 12x10b
- Packaging :
- Tube
- Core Size :
- 8-Bit
- Peripherals :
- Brown-out Detect/Reset, POR, PWM, WDT
- Memory Size :
- 16kB
- RoHS Status :
- ROHS3 Compliant
- Pin Count :
- 68
- Supplier Device Package :
- 68-PLCC (24.23x24.23)
- Width :
- 24.3332mm
- Connectivity :
- I2C, SPI, UART/USART
- Data Converters :
- A/D 12x10b
- Base Product Number :
- PIC17LC752
- Core Processor :
- PIC
- Package / Case :
- 68-LCC (J-Lead)
- Program Memory Size :
- 16KB 8K x 16
- Number of UART Channels :
- 2
- Number of Timers/Counters :
- 4
- Terminal Position :
- QUAD
- Datasheets
- PIC17LC752-08I/L
Microcontrollers Microchip Technology PIC17LC752-08I/L Overview
The Microcontrollers Microchip Technology PIC17LC752-08I/L is a high-performance 8-bit MCU that combines advanced OTP (One-Time Programmable) memory technology with robust processing capabilities, ideally suited for sophisticated control applications. This microcontroller from Microchip Technology is housed in a 68-pin PLCC (Plastic Leaded Chip Carrier) package, ensuring a compact footprint while providing ample pinout for extensive functionality. Its 16KB of integrated OTP memory is perfect for applications requiring one-time programmability with a reliable and cost-effective solution, ensuring both flexibility and security in deployment.
PIC17LC752-08I/L Features
The PIC17LC752-08I/L microcontroller is equipped with several key features that make it a prime choice for demanding applications. It includes 16KB of OTP memory for reliable data storage, a comprehensive set of peripherals such as timers, serial communication interfaces, and analog-to-digital converters which are essential for a wide range of embedded systems. Moreover, its robust interrupt handling capabilities and low-power operation modes provide excellent efficiency and flexibility for complex applications.
PIC17LC752-08I/L Applications
- Industrial Control Systems: The MCU can be used to manage automation processes in factories, controlling machinery and monitoring system status to enhance productivity and safety.
- Automotive Applications: Ideal for embedded control systems in vehicles, such as engine management systems and body electronics, where reliability and endurance are crucial.
- Home Automation: Powers smart home devices, enabling sophisticated home management systems that improve energy efficiency and user comfort.
- Telecommunication Equipment: Supports advanced communication protocols essential for telecommunication infrastructure, contributing to more reliable and faster data transfer.
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