PIC16F1455-I/ML
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- Mfr.Part #
- PIC16F1455-I/ML
- Manufacturer
- Microchip Technology
- Package / Case
- 16-VQFN Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 8BIT 14KB FLASH 16QFN
- Stock
- 1,680
- In Stock ：
- 1,680
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Number of PWM Channels :
- 2
- Minimum Operating Temperature :
- - 40 C
- Oscillator Type :
- Internal
- Base Product Number :
- PIC16F1455
- Frequency :
- 48MHz
- Maximum Operating Temperature :
- + 85 C
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Interface :
- I2C, LIN, SPI, UART, USART, USB
- Product Status :
- Active
- Interfaces :
- I2C/SPI/USART/USB
- RAM Size :
- 1K x 8
- Core Processor :
- PIC
- Bit Size :
- 8
- Program Memory Type :
- Flash
- RoHS Status :
- ROHS3 Compliant
- Surface Mount :
- yes
- Mounting Style :
- SMD/SMT
- Program Memory Size :
- 14KB 8K x 14
- Operating Temperature :
- -40°C~85°C TA
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Form :
- NO LEAD
- Product Category :
- 8-bit Microcontrollers - MCU
- Data Bus Width :
- 8B
- Number of Timers/Counters :
- 3 Timer
- Height :
- 950μm
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Supplier Device Package :
- 16-QFN (4x4)
- Data Converter :
- A/D 5x10b; D/A 1x5b
- Series :
- PIC® XLP™ 16F
- Manufacturer :
- Microchip
- Published :
- 2010
- Terminal Position :
- QUAD
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Factory Lead Time :
- 6 Weeks
- Has ADC :
- yes
- RoHS :
- Details
- Number of I2C Channels :
- 1
- Connectivity :
- I2C, LINbus, SPI, UART/USART, USB
- Number of Pins :
- 16
- REACH SVHC :
- No SVHC
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Interface Type :
- I2C, SPI, USB
- Subcategory :
- Microcontrollers - MCU
- Mounting Type :
- Surface Mount
- Length :
- 4mm
- Speed :
- 48MHz
- Package / Case :
- 16-VQFN Exposed Pad
- Packaging :
- Tube
- Core Size :
- 8-Bit
- Product :
- MCU
- Base Part Number :
- PIC16F1455
- Device Core :
- PIC
- Brand :
- Microchip Technology / Atmel
- Number of Programmable I/O :
- 11
- EEPROM Size :
- -
- JESD-609 Code :
- e3
- Width :
- 4mm
- Number of Terminations :
- 16
- Data Converters :
- A/D 5x10b; D/A 1x5b
- DMA Channels :
- No
- Product Type :
- 8-bit Microcontrollers - MCU
- Tradename :
- PIC
- Number of I/Os :
- 11 I/O
- Memory Size :
- 14kB
- Number of ADC Channels :
- 5
- Lead Free :
- Lead Free
- Peripherals :
- Brown-out Detect/Reset, POR, PWM, WDT
- Voltage - Supply (Vcc/Vdd) :
- 2.3V~5.5V
- Package :
- Tube
- Number of I/O :
- 8
- Datasheets
- PIC16F1455-I/ML
Microcontrollers Microchip Technology PIC16F1455-I/ML Overview
The Microcontrollers Microchip Technology PIC16F1455-I/ML is a compact and powerful microcontroller unit (MCU) designed to offer robust performance with its 8-bit architecture. This product from Microchip Technology is built to cater to the advanced needs of modern embedded systems. Featuring 14KB of flash memory and housed in a 16QFN package, the PIC16F1455-I/ML stands out for its low power consumption and versatile interfacing capabilities. This MCU is specifically designed to achieve efficient operations in both low and high-volume applications, making it an ideal choice for designers seeking reliability and performance in a compact footprint.
PIC16F1455-I/ML Features
- 8-bit processor ensuring cost-effective processing power.
- 14KB flash memory for ample program storage.
- Enhanced mid-range core with 49 instruction, 16 stack levels.
- Flexible oscillator structure with PLL for USB operation.
- Integrated xMHz internal oscillator.
- Low-power consumption modes for energy efficiency.
- Extensive peripheral set with enhanced features.
PIC16F1455-I/ML Applications
- Consumer Electronics: Utilized in smart home devices, offering control and connectivity features that enhance user interaction and automation.
- Automotive Applications: Used in automotive subsystems for sensor integration and dashboard displays, ensuring reliable operation in demanding environments.
- Industrial Control: Powers automated control systems, aiding in precision and scalability of manufacturing processes.
- Medical Devices: Forms the core of handheld medical instruments where compact size and power efficiency are crucial.
- Communication Systems: Supports communication interfaces in telecom infrastructure, contributing to robust data handling and signal processing.
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