PIC16C57CT-20E/SO

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Mfr.Part #
PIC16C57CT-20E/SO
Manufacturer
Microchip Technology
Package / Case
28-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC MCU 8BIT 3KB OTP 28SOIC
Stock
2,984
In Stock :
2,984

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
DAC Channels :
No
Supplier Device Package :
28-SOIC
PWM Channels :
No
Height Seated (Max) :
2.64mm
Connectivity :
--
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Base Part Number :
PIC16C57C
On Chip Program ROM Width :
12
Core Processor :
PIC
Mounting Type :
Surface Mount
Lead Free :
Lead Free
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Published :
2002
Peripherals :
POR, WDT
Product Status :
Obsolete
Program Memory Size :
3KB 2K x 12
RoHS Status :
ROHS3 Compliant
Terminal Position :
Dual
Surface Mount :
yes
Package / Case :
28-SOIC (0.295, 7.50mm Width)
Supply Voltage-Max (Vsup) :
5.5V
EEPROM Size :
--
Power Supplies :
2.5/6.25V
CPU Family :
PIC
Oscillator Type :
External
Series :
PIC® 16C
Frequency :
20MHz
Terminal Finish :
Matte Tin (Sn)
Package :
Tape and Reel (TR)
Number of Terminations :
28
Voltage - Supply (Vcc/Vdd) :
3V~5.5V
Radiation Hardening :
No
Supply Voltage :
5V
Memory Size :
2kB
Memory Type :
EPROM
Bit Size :
8
Packaging :
Tape and Reel (TR)
Has ADC :
No
Watchdog Timer :
yes
DMA Channels :
No
Peak Reflow Temperature (Cel) :
260
Program Memory Type :
OTP
JESD-609 Code :
e3
Data Bus Width :
8B
Supply Voltage-Min (Vsup) :
4.5V
Access Time :
20 μs
Speed :
20MHz
Number of Timers/Counters :
1
Max Power Dissipation :
800mW
Operating Temperature :
-40°C~125°C TA
Terminal Form :
Gull wing
Data Converters :
--
Base Product Number :
PIC16C57
Core Size :
8-Bit
Time@Peak Reflow Temperature-Max (s) :
40
JESD-30 Code :
R-PDSO-G28
RAM Size :
72 x 8
Pin Count :
28
Pbfree Code :
yes
Number of I/O :
20
Datasheets
PIC16C57CT-20E/SO
Introducing Microcontrollers Microchip Technology PIC16C57CT-20E/SO from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:PIC16C57C, Mounting Type:Surface Mount, Package / Case:28-SOIC (0.295, 7.50mm Width), Number of Terminations:28, Operating Temperature:-40°C~125°C TA, PIC16C57CT-20E/SO pinout, PIC16C57CT-20E/SO datasheet PDF, PIC16C57CT-20E/SO amp .Beyond Microcontrollers Microchip Technology PIC16C57CT-20E/SO ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology PIC16C57CT-20E/SO


Microcontrollers Microchip Technology PIC16C57CT-20E/SO Overview

The Microcontrollers Microchip Technology PIC16C57CT-20E/SO is a highly versatile and efficient 8-bit MCU from one of the leading semiconductor manufacturers, Microchip Technology. Designed for applications requiring a robust control system within a compact package, this MCU features 3KB of OTP memory and is housed in a 28SOIC package. Its ability to handle complex algorithms and multiple peripherals makes it ideal for designers seeking a reliable solution for integrated systems. This product, with its enhanced performance features, provides a scalable option for developing advanced and power-sensitive applications in commercial and industrial markets.

PIC16C57CT-20E/SO Features

  • 8-bit microcontroller which efficiently handles data operations and logic functions.
  • 3KB of OTP (One-Time Programmable) memory, allowing for reliable code storage that is essential for firmware development and device management.
  • Available in a 28SOIC package, ideal for compact designs that require robust performance in a small footprint.
  • Wide operating voltage range, suitable for diverse applications and power systems.

PIC16C57CT-20E/SO Applications

  • Consumer Electronics: Utilized in devices such as home appliances and personal gadgets where a compact MCU can enhance user interface and device control.
  • Automotive: Integrated into car entertainment systems and control modules, contributing to more responsive and intuitive user interactions.
  • Industrial Automation: Powers machinery controls and sensor networks, improving process efficiency and reliability.
  • Telecommunications: Used in communication infrastructure equipment to facilitate robust data handling and connectivity features.
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