PIC10LF322-I/MC
- Mfr.Part #
- PIC10LF322-I/MC
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VFDFN Exposed Pad
- Datasheet
- Download
- Description
- IC MCU 8BIT 896B FLASH 8DFN
- Stock
- 14,480
- In Stock :
- 14,480
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Minimum Operating Temperature :
- - 40 C
- Product Category :
- 8-bit Microcontrollers - MCU
- Voltage - Supply (Vcc/Vdd) :
- 1.8V~3.6V
- DAC Channels :
- No
- Data Converters :
- A/D 3x8b
- Series :
- PIC® 10F
- Number of I/O :
- 3
- Product Type :
- 8-bit Microcontrollers - MCU
- Terminal Finish :
- Matte Tin (Sn)
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Number of I/Os :
- 4 I/O
- Length :
- 3 mm
- Tradename :
- PIC
- On Chip Program ROM Width :
- 14
- Data Bus Width :
- 8 bit
- Supply Voltage-Min (Vsup) :
- 2.5V
- Package / Case :
- 8-VFDFN Exposed Pad
- Surface Mount :
- yes
- Height :
- 0.9 mm
- RoHS Status :
- ROHS3 Compliant
- RAM Size :
- 64 x 8
- Maximum Operating Temperature :
- + 85 C
- Published :
- 2011
- Has ADC :
- yes
- ECCN Code :
- EAR99
- Core Processor :
- PIC
- Package :
- Tube
- DMA Channels :
- No
- Bit Size :
- 8
- Pin Count :
- 8
- Data Converter :
- A/D 3x8b
- Supplier Device Package :
- 8-DFN (2x3)
- JESD-30 Code :
- R-PDSO-N8
- PWM Channels :
- yes
- Qualification Status :
- Not Qualified
- Device Core :
- PIC
- Base Product Number :
- PIC10LF322
- Terminal Position :
- Dual
- Mounting Style :
- SMD/SMT
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Number of ADC Channels :
- 3 Channel
- Connectivity :
- --
- Mounting Type :
- Surface Mount
- Speed :
- 16MHz
- Oscillator Type :
- Internal
- Supply Voltage :
- 3.3V
- RoHS :
- Details
- Program Memory Size :
- 896B 512 x 14
- Additional Feature :
- OPERATES AT 1.8 V MINIMUM SUPPLY AT 16 MHZ
- Product Status :
- Active
- Brand :
- Microchip Technology
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Width :
- 2mm
- Terminal Form :
- NO LEAD
- Terminal Pitch :
- 0.5mm
- Clock Frequency :
- 20MHz
- CPU Family :
- PIC
- Height Seated (Max) :
- 1mm
- Core Size :
- 8-Bit
- JESD-609 Code :
- e3
- Factory Lead Time :
- 7 Weeks
- Number of Timers/Counters :
- 2 Timer
- Number of Terminations :
- 8
- EEPROM Size :
- --
- Program Memory Type :
- Flash
- Manufacturer :
- Microchip
- Peak Reflow Temperature (Cel) :
- 260
- ROM (words) :
- 512
- Base Part Number :
- PIC10LF322
- Peripherals :
- Brown-out Detect/Reset, POR, PWM, WDT
- Operating Temperature :
- -40°C~85°C TA
- Packaging :
- Tray
- Datasheets
- PIC10LF322-I/MC

Microcontrollers Microchip Technology PIC10LF322-I/MC Overview
The Microcontrollers Microchip Technology PIC10LF322-I/MC is a highly versatile and efficient microcontroller unit (MCU) designed for advanced embedded applications. Manufactured by Microchip Technology, this compact 8-bit MCU features 896 bytes of flash memory packed into an 8DFN package, making it ideal for space-constrained and power-sensitive applications. Its robust architecture and adaptable nature allow it to perform exceptionally in a variety of complex digital and analog integrations, making it a prime choice for designers looking to develop sophisticated yet compact systems.
PIC10LF322-I/MC Features
The PIC10LF322-I/MC microcontroller boasts a variety of features that enhance its functionality and adaptability in numerous applications. Key features include a 8-bit processor, 896 bytes of on-board flash memory, and low power consumption. Its small form factor (8DFN package) is optimized for space-limited applications, while its wide operating voltage range and programmable logic elements make it incredibly flexible for integration into multi-functional devices.
PIC10LF322-I/MC Applications
- Consumer Electronics: Utilized in small household appliances and personal gadgets due to its compact size and efficiency.
- Automotive Applications: Employed in automotive electronics for control systems that require low latency and high reliability.
- Industrial Automation: Ideal for integration into sensors and small-scale control systems in automated manufacturing setups, where precision and minimal footprint are crucial.
- Wearable Technology: Serves as the core processing unit in wearables, supporting smart functionalities while maintaining low power consumption.
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