OSD3358-512M-BSM
- Mfr.Part #
- OSD3358-512M-BSM
- Manufacturer
- Octavo Systems
- Package / Case
- Datasheet
- Download
- Description
- IC MODULE CORTEX-A8 1GHZ 512MB
- Stock
- 75
- In Stock :
- 75
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- Manufacturer :
- Octavo Systems
- Product Category :
- Microcontrollers, Microprocessor, FPGA Modules
- Size / Dimension :
- 0.83 x 0.83 21mmx21mm
- RAM Size :
- 512MB
- Connector Type :
- 256-BGA
- Published :
- 2016
- Speed :
- 1GHz
- Co-Processor :
- NEON™ SIMD
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 10 Weeks
- Operating Temperature :
- 0°C~85°C
- Module/Board Type :
- MPU Core
- RoHS Status :
- ROHS3 Compliant
- Core Processor :
- ARM® Cortex®-A8, AM3358
- Series :
- OSD335x
- Datasheets
- OSD3358-512M-BSM

MPU Core ARM® Cortex®-A8, AM3358 0.83 x 0.83 21mmx21mm 0°C~85°C 256-BGA OSD335x 512MB 1GHz
OSD3358-512M-BSM Description
The OSD3358-512M-BSM System-In-Package (SiP) product is building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD3358-512M-BSM integrates the AM335x along with the TI TPS65217C PMIC, the TI TL5209 LDO, up to 1 Gigabyte (GB) of DDR3 Memory, a 4Kilobyte (KB)EEPROM for non-volatile configuration storage and resistors, capacitors, and inductors into a single 21mm x21mm design-in-ready package
OSD3358-512M-BSM Features
TI AM335x, TPS65217C, TL5209, DDR3, EEPROM, and passive components integrated into a single package
ARM®Cortex®-A8 up to 1GHz
8 channel 12-bit SAR ADC
Ethernet 10/100/1000 x 2
USB 2.0 HS OTG + PHY x2
MMC, SD, and SDIO x3
LCD Controller
SGX 3D Graphics Engine
PRU Subsystem
Access to all AM335x Peripherals: CAN, SPI, UART, I2C, GPIO, etc
OSD3358-512M-BSM Applications
Automotive
Advanced driver assistance systems (ADAS)
Enterprise systems
Datacenter & enterprise computing
Personal electronics
Home theater & entertainment
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