MTLW-116-06-S-S-180
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- Mfr.Part #
- MTLW-116-06-S-S-180
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 16POS 2.54MM
- Stock
- 12,868
- In Stock ：
- 12,868
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Number of Positions Loaded :
- All
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Contact Length - Post :
- 0.060 1.52mm
- Current Rating (Amps) :
- 5.2A per Contact
- Published :
- 2016
- Option :
- GENERAL PURPOSE
- Pitch - Mating :
- 0.100 2.54mm
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Radiation Hardening :
- No
- Insulation Height :
- 0.060 1.52mm
- Series :
- Flex Stack, MTLW
- IEC Conformance :
- No
- Additional Feature :
- LOW PROFILE
- Terminal Pitch :
- 2.54mm
- Contact Finish - Mating :
- Gold
- Contact Length - Mating :
- 0.180 4.57mm
- Connector Type :
- Header
- Packaging :
- Bulk
- Shrouding :
- Unshrouded
- Style :
- Board to Board or Cable
- Factory Lead Time :
- 3 Weeks
- Contact Type :
- Male Pin
- Number of Positions :
- 16
- Gender :
- Male
- Contact Finish - Post :
- Tin
- Mounting Type :
- Through Hole
- Contact Material :
- Phosphor Bronze
- Material Flammability Rating :
- UL94 V-0
- Insulation Color :
- Black
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mixed Contacts :
- No
- RoHS Status :
- ROHS3 Compliant
- Mount :
- Through Hole
- Number of Rows :
- 1
- JESD-609 Code :
- e3
- Fastening Type :
- Push-Pull
- Contact Shape :
- Square
- DIN Conformance :
- No
- Filter Feature :
- No
- UL Flammability Code :
- 94V-0
- Operating Temperature :
- -55°C~125°C
- MIL Conformance :
- No
- Termination :
- Solder
- Overall Contact Length :
- 0.300 7.62mm
- Datasheets
- MTLW-116-06-S-S-180
Flex Stack, MTLW Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 16-Position Board to Board or Cable 0.060 1.52mm Height
MTLW-116-06-S-S-180 Overview
Currently, it is packaged in Header.The mounting type of the device is Through Hole.A Bulk case is used to package the product.A product of the Flex Stack, MTLW Series, it belongs to the range of products of that series.Furthermore, there are other features available, such as LOW PROFILE, to name a few.Through Hole represents the mounting point for the part.-55°C~125°C Operating Temperature is the default operating temperature for the device.
MTLW-116-06-S-S-180 Features
Flex Stack, MTLW series
MTLW-116-06-S-S-180 Applications
There are a lot of Samtec Inc.
MTLW-116-06-S-S-180 Rectangular Connectors applications.
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
- Data Technology
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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