MTLW-112-08-S-D-360

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Mfr.Part #
MTLW-112-08-S-D-360
Manufacturer
Samtec, Inc.
Package / Case
Datasheet
Download
Description
CONN HEADER VERT 24POS 2.54MM
Stock
11,612
In Stock :
11,612

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Manufacturer :
Samtec, Inc.
Product Category :
Headers, Male Pins
Insulation Height :
0.060 1.52mm
Contact Type :
Male Pin
Row Spacing - Mating :
0.100 (2.54mm)
Series :
Flex Stack, MTLW
Mount :
Through Hole
Filter Feature :
No
Option :
GENERAL PURPOSE
MIL Conformance :
No
Contact Length - Post :
0.110 2.79mm
Material Flammability Rating :
UL94 V-0
Termination :
Solder
Contact Finish - Post :
Tin
Connector Type :
Header
Contact Finish Thickness - Mating :
30.0μin 0.76μm
Style :
Board to Board or Cable
Number of Positions Loaded :
All
Pitch - Mating :
0.100 2.54mm
Contact Finish - Mating :
Gold
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Packaging :
Bulk
Number of Rows :
2
DIN Conformance :
No
IEC Conformance :
No
Gender :
Male
Insulation Material :
Liquid Crystal Polymer (LCP)
Shrouding :
Unshrouded
Operating Temperature :
-55°C~125°C
Number of Positions :
24
Mixed Contacts :
No
Overall Contact Length :
0.530 13.46mm
Mounting Type :
Through Hole
Factory Lead Time :
3 Weeks
Current Rating (Amps) :
5.2A per Contact
Insulation Color :
Black
Contact Length - Mating :
0.360 9.14mm
Pbfree Code :
yes
Fastening Type :
Push-Pull
Contact Material :
Phosphor Bronze
JESD-609 Code :
e3
Contact Shape :
Square
Datasheets
MTLW-112-08-S-D-360
Introducing Headers, Male Pins Samtec, Inc. MTLW-112-08-S-D-360 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-55°C~125°C, Mounting Type:Through Hole, MTLW-112-08-S-D-360 pinout, MTLW-112-08-S-D-360 datasheet PDF, MTLW-112-08-S-D-360 amp .Beyond Headers, Male Pins Samtec, Inc. MTLW-112-08-S-D-360 ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.



Flex Stack, MTLW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 24-Position Board to Board or Cable 0.060 1.52mm Height

MTLW-112-08-S-D-360 Overview


Packaging is in the form of Header.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the Flex Stack, MTLW Series.There is a mounting hole at Through Hole.Devices operate at -55°C~125°C operating temperatures.

MTLW-112-08-S-D-360 Features


Flex Stack, MTLW series


MTLW-112-08-S-D-360 Applications


There are a lot of Samtec Inc.
MTLW-112-08-S-D-360 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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