MTLW-104-05-G-D-141
- Mfr.Part #
- MTLW-104-05-G-D-141
- Manufacturer
- Samtec, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN HEADER VERT 8POS 2.54MM
- Stock
- 44
- In Stock :
- 44
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- Manufacturer :
- Samtec, Inc.
- Product Category :
- Headers, Male Pins
- Number of Positions Loaded :
- All
- Material Flammability Rating :
- UL94 V-0
- Shrouding :
- Unshrouded
- Connector Type :
- Header
- Insulation Material :
- Liquid Crystal Polymer (LCP)
- Insulation Height :
- 0.060 1.52mm
- RoHS Status :
- ROHS3 Compliant
- Contact Finish Thickness - Post :
- 3.00μin 0.076μm
- Contact Finish Thickness - Mating :
- 10.0μin 0.25μm
- Contact Length - Mating :
- 0.141 3.60mm
- Contact Material :
- Phosphor Bronze
- Factory Lead Time :
- 3 Weeks
- Contact Finish - Mating :
- Gold
- Pitch - Mating :
- 0.100 2.54mm
- Insulation Color :
- Black
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Row Spacing - Mating :
- 0.100 (2.54mm)
- Series :
- Flex Stack, MTLW
- Termination :
- Solder
- Mounting Type :
- Through Hole
- Overall Contact Length :
- 0.335 8.51mm
- Number of Rows :
- 2
- Operating Temperature :
- -55°C~125°C
- Current Rating (Amps) :
- 5.2A per Contact
- Contact Length - Post :
- 0.134 3.40mm
- Style :
- Board to Board or Cable
- Packaging :
- Bulk
- Contact Shape :
- Square
- Contact Type :
- Male Pin
- Fastening Type :
- Push-Pull
- Number of Positions :
- 8
- Datasheets
- MTLW-104-05-G-D-141
Flex Stack, MTLW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 8-Position Board to Board or Cable 0.060 1.52mm Height
MTLW-104-05-G-D-141 Overview
This product is packaged in a Header carton.Through Hole is the mounting type for the device.The product is packaged in a Bulk case.It's part of the Flex Stack, MTLW Series.It runs at -55°C~125°C Operating Temperature.
MTLW-104-05-G-D-141 Features
Flex Stack, MTLW series
MTLW-104-05-G-D-141 Applications
There are a lot of Samtec Inc.
MTLW-104-05-G-D-141 Rectangular Connectors applications.
- Industrial Automation
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
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