MT53E384M32D2DS-053 AUT:E TR

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Mfr.Part #
MT53E384M32D2DS-053 AUT:E TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 1.866GHZ 200WFBGA
Stock
31,374
In Stock :
31,374

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Manufacturer :
Micron Technology
Product Category :
Memory
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
1.866GHz
Memory Size :
12Gb 384M x 32
Memory Type :
Volatile
Package / Case :
200-WFBGA
Operating Temperature :
-40°C~125°C TC
Memory Format :
DRAM
RoHS Status :
ROHS3 Compliant
Packaging :
Tape and Reel (TR)
Voltage - Supply :
0.6V 1.1V
Introducing Memory Micron Technology MT53E384M32D2DS-053 AUT:E TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:200-WFBGA, Operating Temperature:-40°C~125°C TC, MT53E384M32D2DS-053 AUT:E TR pinout, MT53E384M32D2DS-053 AUT:E TR datasheet PDF, MT53E384M32D2DS-053 AUT:E TR amp .Beyond Memory Micron Technology MT53E384M32D2DS-053 AUT:E TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53E384M32D2DS-053 AUT:E TR


Memory Micron Technology MT53E384M32D2DS-053 AUT:E TR Overview

Introducing the Memory Micron Technology MT53E384M32D2DS-053 AUT:E TR, a high-performance Integrated Circuit (IC) from Micron Technology, designed to elevate data processing capabilities across a wide array of applications. This IC features a robust 12Gbit DRAM capacity and operates at a high speed of 1.866GHz. Encased in a compact 200-ball fine pitch BGA (WFBGA) package, it offers superior durability and performance essential for modern, high-demand systems. Its design and specifications ensure it meets the rigorous needs of advanced computing and large-scale digital storage, making it a pivotal component in the development of next-generation technologies.

MT53E384M32D2DS-053 AUT:E TR Features

The MT53E384M32D2DS-053 AUT:E TR stands out with its substantial 12GBit density and high-speed interface of 1.866GHz, making it ideal for applications requiring fast and reliable data access. The 200WFBGA packaging not only ensures a reduced footprint on system boards but also enhances signal integrity and thermal performance. This DRAM module is specifically engineered for stability under extensive operational conditions, thus ensuring peak performance at all times.

MT53E384M32D2DS-053 AUT:E TR Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computers where large memory capacity and speed are critical for handling complex computations and large data sets efficiently.
  • Networking Equipment: Essential for high-speed network routers and switches, facilitating rapid data transfer and buffering to enhance network performance and reliability.
  • Data Centers: Supports the backbone of cloud storage and online applications by providing the extensive memory capacity needed for massive data processing and storage tasks.
  • Consumer Electronics: Implemented in high-end gaming consoles and personal computers, where its speed and capacity contribute to enhanced gaming experiences and multimedia processing.
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Shipping Cost

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