MT53E384M32D2DS-046 AIT:E TR

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Mfr.Part #
MT53E384M32D2DS-046 AIT:E TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 2.133GHZ 200WFBGA
Stock
39,942
In Stock :
39,942

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Size :
12Gb 384M x 32
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-40°C~95°C TC
Package / Case :
200-WFBGA
Mounting Type :
Surface Mount
Clock Frequency :
2.133GHz
RoHS Status :
ROHS3 Compliant
Memory Format :
DRAM
Packaging :
Tape and Reel (TR)
Voltage - Supply :
0.6V 1.1V
Introducing Memory Micron Technology MT53E384M32D2DS-046 AIT:E TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~95°C TC, Package / Case:200-WFBGA, Mounting Type:Surface Mount, MT53E384M32D2DS-046 AIT:E TR pinout, MT53E384M32D2DS-046 AIT:E TR datasheet PDF, MT53E384M32D2DS-046 AIT:E TR amp .Beyond Memory Micron Technology MT53E384M32D2DS-046 AIT:E TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53E384M32D2DS-046 AIT:E TR


Memory Micron Technology MT53E384M32D2DS-046 AIT:E TR Overview

The Memory Micron Technology MT53E384M32D2DS-046 AIT:E TR DRAM module is engineered to meet the rigorous demands of high-performance computing systems. Offering a substantial 12GB of capacity and a swift 2.133GHz clock speed, this memory module utilizes a 200-ball WFBGA package to deliver superior thermal performance and reliability. Designed by Micron Technology, a leader in advanced memory solutions, this product ensures efficient handling of large datasets and multitasking operations. The high-speed interface complements modern CPUs and GPUs, making it an ideal choice for intensive applications that require robust data throughput and low-latency access.

MT53E384M32D2DS-046 AIT:E TR Features

This DRAM IC features a 12Gbit density, which provides ample space for heavy applications while maintaining a high speed of 2.133GHz for rapid access and processing. Its 200 WFBGA package is designed for optimal thermal management and reduced footprint on PCB layouts. The product's low-power consumption and high data transfer rate make it suitable for energy-efficient yet demanding computing environments.

MT53E384M32D2DS-046 AIT:E TR Applications

  • Advanced Computing Systems: Utilized in servers and high-end workstations for efficient data processing and storage management.
  • Networking Equipment: Enhances the performance of network routers and switches through faster data buffering and large-scale information handling.
  • Gaming Consoles: Provides the high memory bandwidth required for graphic-intensive games, supporting enhanced user experiences and quicker loading times.
  • Data Centers: Key component in data center infrastructure, supporting large database applications and cloud computing services with high data integrity and speed.
  • Mobile Devices: Employs in smartphones and tablets where high performance and low energy consumption are essential for multitasking and media applications.
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Shipping Cost

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