MT53E256M32D2DS-046 AAT:B
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- Mfr.Part #
- MT53E256M32D2DS-046 AAT:B
- Manufacturer
- Micron Technology
- Package / Case
- 200-WFBGA
- Datasheet
- Download
- Description
- IC DRAM 8GBIT 2.133GHZ 200WFBGA
- Stock
- 13,657
- In Stock ：
- 13,657
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Memory Format :
- DRAM
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Memory Size :
- 8Gb 256M x 32
- Voltage - Supply :
- 0.6V 1.1V
- Terminal Form :
- Ball
- Memory Type :
- Volatile
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Mode :
- SYNCHRONOUS
- Package / Case :
- 200-WFBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Organization :
- 256MX32
- Memory Density :
- 8589934592 bit
- Surface Mount :
- yes
- Memory Width :
- 32
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Ports :
- 1
- Clock Frequency :
- 2.133GHz
- Operating Temperature :
- -40°C~105°C
- Number of Functions :
- 1
- JESD-30 Code :
- X-PBGA-B
- Datasheets
- MT53E256M32D2DS-046 AAT:B
Memory Micron Technology MT53E256M32D2DS-046 AAT:B Overview
The Memory Micron Technology MT53E256M32D2DS-046 AAT:B is an advanced 8Gbit DRAM IC, engineered to deliver high-speed performance and energy efficiency. Manufactured by Micron Technology, this memory module is tailored for high-bandwidth and high-capacity applications, operating at a speed of 2.133GHz. Its compact 200-ball WFBGA (Fine-pitch Ball Grid Array) packaging ensures a reduced footprint while enhancing thermal performance, making it an ideal choice for advanced computing environments that require robust, scalable memory solutions.
MT53E256M32D2DS-046 AAT:B Features
This DRAM IC boasts a series of features designed for superior performance and reliability. Key attributes include a high data rate of 2.133GHz, which facilitates swift access and processing of large datasets. The 8Gbit capacity allows for substantial storage within a small form factor, contributing to system compactness. The 200WFBGA packaging not only offers a compact solution but also ensures improved thermal characteristics, crucial for maintaining stability and performance under varying operational conditions.
MT53E256M32D2DS-046 AAT:B Applications
- Smartphones and Tablets: Integrates into mobile devices to enhance multitasking and media playback capabilities, ensuring smooth operation and robust application support.
- Personal Computers and Laptops: Serves as system memory, supporting demanding applications and intensive multitasking in personal computing devices.
- Server Solutions: Utilized in server farms and data centers for efficient data handling and high-speed processing tasks, enhancing overall system responsiveness and reliability.
- Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to process and store large amounts of data in real-time, improving vehicle response and safety features.
- Embedded Systems: Provides memory solutions for embedded applications in industrial, medical, and consumer electronics, where stability and reliability are paramount.
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