MT53E1G32D2NP-046 WT:B TR

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Mfr.Part #
MT53E1G32D2NP-046 WT:B TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC MEMORY DRAM 32G 1GX32 FBGA
Stock
2,024
In Stock :
2,024

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Manufacturer :
Micron Technology
Product Category :
Memory
Product Status :
Active
Memory Size :
32 Gbit
Data Bus Width :
32 bit
Clock Frequency :
2.133 GHz
RoHS :
Details
Base Product Number :
MT53E1G32
Package / Case :
200-WFBGA
Mounting Style :
SMD/SMT
Memory Type :
Volatile
Maximum Operating Temperature :
+ 85 C
Packaging :
Reel
Series :
-
Operating Temperature :
-30°C ~ 85°C (TC)
Package :
Tape and Reel (TR)
Mounting Type :
Surface Mount
Write Cycle Time - Word, Page :
-
Memory Organization :
1G x 32
Minimum Operating Temperature :
- 30 C
Organization :
1 G x 32
Memory Format :
DRAM
Voltage - Supply :
1.1V
Type :
SDRAM Mobile - LPDDR4
Memory Interface :
-
Supplier Device Package :
200-WFBGA (10x14.5)
Technology :
SDRAM - Mobile LPDDR4
Introducing Memory Micron Technology MT53E1G32D2NP-046 WT:B TR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Operating Temperature:-30°C ~ 85°C (TC), Mounting Type:Surface Mount, Type:SDRAM Mobile - LPDDR4, MT53E1G32D2NP-046 WT:B TR pinout, MT53E1G32D2NP-046 WT:B TR datasheet PDF, MT53E1G32D2NP-046 WT:B TR amp .Beyond Memory Micron Technology MT53E1G32D2NP-046 WT:B TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53E1G32D2NP-046 WT:B TR


Memory Micron Technology MT53E1G32D2NP-046 WT:B TR Overview

The Memory Micron Technology MT53E1G32D2NP-046 WT:B TR is an advanced IC MEMORY DRAM component designed for high-performance computing solutions. Featuring a 32G capacity and a 1GX32 configuration, this product leverages Micron Technology's industry-leading technology to deliver high-speed data transfer and low-power consumption. Ideal for applications requiring large-scale data processing and storage, this DRAM module is built to support the rigorous demands of modern computing environments, ensuring reliability and efficiency in a compact FBGA package.

MT53E1G32D2NP-046 WT:B TR Features

This dynamic memory chip offers high density and speed, making it a prime choice for developers and manufacturers focusing on the next generation of technology. Key features include a high capacity of 32 gigabits and a streamlined architecture that facilitates rapid access and processing of large data blocks, making it highly suitable for advanced computing and graphic-intensive applications.

MT53E1G32D2NP-046 WT:B TR Applications

  • High-Performance Computing (HPC): Utilized in servers and workstations for complex calculations, simulations, and data analysis, enhancing processing capabilities and system efficiency.
  • Data Centers: Supports large-scale data storage and processing operations, ensuring high-speed data retrieval and continuous system performance.
  • Networking Equipment: Integrated into routers and switches to manage high volumes of data traffic efficiently, reducing latency and improving data throughput.
  • Gaming Consoles: Employs its high-speed data processing to deliver enhanced gaming experiences with reduced load times and smoother gameplay.
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Payment Method

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IMPORTANT NOTICE

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Shipping Method

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Shipping Cost

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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

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