MT53D768M64D8NZ-046 WT ES:E TR

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Mfr.Part #
MT53D768M64D8NZ-046 WT ES:E TR
Manufacturer
Micron Technology
Package / Case
376-WFBGA
Datasheet
Download
Description
IC DRAM 48GBIT 2133MHZ 376WFBGA
Stock
35,276
In Stock :
35,276

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Manufacturer :
Micron Technology
Product Category :
Memory
Clock Frequency :
2133MHz
Memory Size :
48Gb 768M x 64
Memory Type :
Volatile
Packaging :
Tape and Reel (TR)
Operating Temperature :
-30°C~85°C TC
Mounting Type :
Surface Mount
Voltage - Supply :
1.1V
Memory Format :
DRAM
Supplier Device Package :
376-WFBGA (14x14)
Package / Case :
376-WFBGA
Introducing Memory Micron Technology MT53D768M64D8NZ-046 WT ES:E TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-30°C~85°C TC, Mounting Type:Surface Mount, Package / Case:376-WFBGA, MT53D768M64D8NZ-046 WT ES:E TR pinout, MT53D768M64D8NZ-046 WT ES:E TR datasheet PDF, MT53D768M64D8NZ-046 WT ES:E TR amp .Beyond Memory Micron Technology MT53D768M64D8NZ-046 WT ES:E TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D768M64D8NZ-046 WT ES:E TR


Memory Micron Technology MT53D768M64D8NZ-046 WT ES:E TR Overview

The Memory Micron Technology MT53D768M64D8NZ-046 WT ES:E TR is a high-capacity, high-performance integrated circuit designed by Micron Technology, specializing in DRAM solutions. This IC DRAM features a massive 48Gbit density and operates at a speed of 2133 MHz, encapsulated in a compact 376-ball WFBGA package. This product caters to advanced computing systems requiring extensive data buffering and storage capabilities, such as server farms, data centers, and high-performance computing applications. The robust build and enhanced data rate make the Memory Micron Technology MT53D768M64D8NZ-046 WT ES:E TR a cornerstone for developers looking to maximize memory bandwidth and system reliability in demanding operational environments.

MT53D768M64D8NZ-046 WT ES:E TR Features

This DRAM module is engineered to support high-speed data transfer rates of 2133 MHz, providing substantial throughput for data-intensive applications. Its 48Gbit capacity enables significant storage potential for large-scale operations, while the 376WFBGA packaging ensures a reduced footprint on system boards, facilitating more efficient space management in multi-chip configurations.

MT53D768M64D8NZ-046 WT ES:E TR Applications

  • Data Centers: Utilizes its high storage capacity and speed to manage large databases and handle vast amounts of data transactions seamlessly.
  • High-Performance Computing (HPC): Employs its rapid processing capabilities to execute complex computations and support scientific research, financial modeling, and engineering simulations.
  • Server Farms: Ideal for server applications where high density and fast access to large volumes of data are crucial for efficient server performance and reliability.
  • Telecommunications Infrastructure: Supports the high-speed processing needs of telecommunications systems, ensuring robust and reliable performance for managing network operations.
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