MT53D512M32D2NP-062 WT:D TR

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Mfr.Part #
MT53D512M32D2NP-062 WT:D TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 1600MHZ 200WFBGA
Stock
7,673
In Stock :
7,673

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Manufacturer :
Micron Technology
Product Category :
Memory
Package / Case :
200-WFBGA
Memory Size :
16Gb 512M x 32
Memory Type :
Volatile
RoHS Status :
ROHS3 Compliant
Packaging :
Tape and Reel (TR)
Voltage - Supply :
1.1V
Supplier Device Package :
200-WFBGA (10x14.5)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Clock Frequency :
1600MHz
Operating Temperature :
-30°C~85°C TC
Memory Format :
DRAM
Introducing Memory Micron Technology MT53D512M32D2NP-062 WT:D TR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Mounting Type:Surface Mount, Operating Temperature:-30°C~85°C TC, MT53D512M32D2NP-062 WT:D TR pinout, MT53D512M32D2NP-062 WT:D TR datasheet PDF, MT53D512M32D2NP-062 WT:D TR amp .Beyond Memory Micron Technology MT53D512M32D2NP-062 WT:D TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D512M32D2NP-062 WT:D TR


Memory Micron Technology MT53D512M32D2NP-062 WT:D TR Overview

The Memory Micron Technology MT53D512M32D2NP-062 WT:D TR IC DRAM stands out in the market with its robust 16Gbit density and a high-speed performance of 1600MHz. Manufactured by Micron Technology, a leader in the memory and storage solutions industry, this product is designed to meet the sophisticated demands of modern applications requiring high bandwidth and low power consumption. Encapsulated in a compact 200-ball WFBGA package, it ensures efficient thermal management and space-saving on system boards, making it ideal for a wide range of industrial applications.

MT53D512M32D2NP-062 WT:D TR Features

This high-capacity DRAM module features a 16Gbit density and a speed grade of 1600MHz, which provides optimal performance for applications requiring rapid access to large volumes of data. The 200-ball WFBGA packaging not only aids in superior space management but also enhances the reliability and durability of the module under varied environmental conditions.

MT53D512M32D2NP-062 WT:D TR Applications

  • High-Performance Computing (HPC): Utilizes its high-speed data processing capabilities to manage complex calculations and data analysis, supporting advancements in research and data-driven sciences.
  • Networking Equipment: Employs its large capacity and fast speeds to enhance data throughput and efficiency in routers, switches, and other networking hardware.
  • Consumer Electronics: Integral for providing the necessary bandwidth and storage capacity for multimedia applications and gaming consoles, ensuring smooth and responsive user experiences.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by handling large volumes of real-time data essential for vehicle safety and operational efficiency.
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