MT53D512M32D2NP-046 AUT ES:D

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Mfr.Part #
MT53D512M32D2NP-046 AUT ES:D
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 2133MHZ 200WFBGA
Stock
22,622
In Stock :
22,622

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Manufacturer :
Micron Technology
Product Category :
Memory
Package / Case :
200-WFBGA
Memory Size :
16Gb 512M x 32
Memory Format :
DRAM
Voltage - Supply :
1.1V
Mounting Type :
Surface Mount
Packaging :
Tape and Reel (TR)
Factory Lead Time :
12 Weeks
Clock Frequency :
2133MHz
Operating Temperature :
-40°C~125°C TC
Memory Type :
Volatile
Introducing Memory Micron Technology MT53D512M32D2NP-046 AUT ES:D from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C TC, MT53D512M32D2NP-046 AUT ES:D pinout, MT53D512M32D2NP-046 AUT ES:D datasheet PDF, MT53D512M32D2NP-046 AUT ES:D amp .Beyond Memory Micron Technology MT53D512M32D2NP-046 AUT ES:D ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D512M32D2NP-046 AUT ES:D


Memory Micron Technology MT53D512M32D2NP-046 AUT ES:D Overview

The Memory Micron Technology MT53D512M32D2NP-046 AUT ES:D is a high-performance IC DRAM designed for advanced computing systems. Manufactured by Micron Technology, this 16Gbit DRAM module operates at a speed of 2133MHz and is packaged in a 200-ball WFBGA (fine-pitch ball grid array). The product's robust data transfer rate and storage capacity make it ideal for handling complex applications and large datasets, ensuring smooth operation and enhanced system reliability. Its cutting-edge design and manufacturing excellence underscore Micron Technology's commitment to providing top-tier memory solutions.

MT53D512M32D2NP-046 AUT ES:D Features

This DRAM module boasts several key features that make it stand out. With a capacity of 16Gbit and a clock speed of 2133MHz, it offers fast and efficient performance for demanding applications. The 200WFBGA packaging not only reduces the physical footprint but also enhances thermal management and electrical integrity, making it suitable for compact and high-performance systems.

MT53D512M32D2NP-046 AUT ES:D Applications

  • Enterprise Servers: Utilized for its high-speed data processing capabilities, enhancing server responsiveness and multitasking capabilities in data centers.
  • High-Performance Computing (HPC) Systems: Serves as a core component in HPC systems where large volumes of data require rapid access and processing to perform complex computations.
  • Gaming Consoles: Improves gaming experiences by accelerating load times and facilitating smoother gameplay with its high transfer rates and large bandwidth.
  • Advanced Driver Assistance Systems (ADAS): Employs in automotive applications for real-time processing of sensor data, crucial for safety-critical functions in modern vehicles.
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