MT53D512M32D2NP-046 AIT ES:D TR

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Mfr.Part #
MT53D512M32D2NP-046 AIT ES:D TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 2133MHZ 200WFBGA
Stock
48,022
In Stock :
48,022

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Manufacturer :
Micron Technology
Product Category :
Memory
Operating Temperature :
-40°C~85°C TA
Clock Frequency :
2133MHz
Packaging :
Tape and Reel (TR)
Voltage - Supply :
1.1V
Memory Format :
DRAM
Mounting Type :
Surface Mount
Memory Type :
Volatile
Memory Size :
16Gb 512M x 32
Package / Case :
200-WFBGA
Introducing Memory Micron Technology MT53D512M32D2NP-046 AIT ES:D TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Package / Case:200-WFBGA, MT53D512M32D2NP-046 AIT ES:D TR pinout, MT53D512M32D2NP-046 AIT ES:D TR datasheet PDF, MT53D512M32D2NP-046 AIT ES:D TR amp .Beyond Memory Micron Technology MT53D512M32D2NP-046 AIT ES:D TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D512M32D2NP-046 AIT ES:D TR


Memory Micron Technology MT53D512M32D2NP-046 AIT ES:D TR Overview

The Memory Micron Technology MT53D512M32D2NP-046 AIT ES:D TR is a state-of-the-art DRAM IC that provides a robust 16 Gbit storage capacity optimized for high-speed applications at 2133 MHz. This product is packaged in a compact 200-ball WFBGA, ensuring high-density integration suitable for advanced electronic devices. Designed by Micron Technology, a leader in memory innovation, this component meets the stringent demands of modern technology infrastructures, offering reliable performance and scalability. Its high-speed data transfer capabilities make it an ideal choice for industries looking for substantial memory solutions in compact devices.

MT53D512M32D2NP-046 AIT ES:D TR Features

This DRAM IC features a significant 16 Gbit density, coupled with a fast 2133 MHz speed, allowing for efficient processing of large datasets. The 200 WFBGA packaging not only provides a space-efficient footprint but also enhances the thermal management and reliability of the module. This component is tailored to deliver high-performance memory solutions with reduced power consumption, making it a sustainable choice for power-sensitive applications.

MT53D512M32D2NP-046 AIT ES:D TR Applications

  • Enterprise Servers: Employs high-capacity memory to manage extensive databases and complex applications, enhancing server efficiency and reliability in data centers.
  • High-Performance Computing (HPC): Supports computational demands with fast memory speeds, essential for simulations and scientific calculations in research and development sectors.
  • Networking Equipment: Utilized in routers and switches to handle high-speed data transfer and processing, improving network traffic management.
  • Consumer Electronics: Integral in providing the necessary memory for multimedia devices, gaming consoles, and smart TVs, ensuring smooth user experiences with high-definition content.
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