MT53D512M32D2NP-046 AIT:D

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Mfr.Part #
MT53D512M32D2NP-046 AIT:D
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 2133MHZ 200WFBGA
Stock
18,560
In Stock :
18,560

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tray
Memory Type :
Volatile
Memory Size :
16Gb 512M x 32
Voltage - Supply :
1.1V
Memory Format :
DRAM
RoHS Status :
ROHS3 Compliant
Operating Temperature :
-40°C~85°C TA
Clock Frequency :
2133MHz
Mounting Type :
Surface Mount
Package / Case :
200-WFBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing Memory Micron Technology MT53D512M32D2NP-046 AIT:D from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Package / Case:200-WFBGA, MT53D512M32D2NP-046 AIT:D pinout, MT53D512M32D2NP-046 AIT:D datasheet PDF, MT53D512M32D2NP-046 AIT:D amp .Beyond Memory Micron Technology MT53D512M32D2NP-046 AIT:D ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D512M32D2NP-046 AIT:D


Memory Micron Technology MT53D512M32D2NP-046 AIT:D Overview

Introducing the Memory Micron Technology MT53D512M32D2NP-046 AIT:D, a cutting-edge IC DRAM designed by Micron Technology. This dynamic random-access memory module boasts an impressive 16Gbit density and operates at a speed of 2133MHz, encapsulated in a 200-ball WFBGA (fine-pitch ball grid array) package. Engineered for high-performance applications that demand reliable and rapid access to large amounts of data, this product is an ideal solution for businesses looking to boost their technology infrastructure with high speed and capacity.

MT53D512M32D2NP-046 AIT:D Features

The MT53D512M32D2NP-046 AIT:D offers a suite of features that make it a powerful component in any tech stack. Its high-speed interface rated at 2133 MHz ensures swift data processing and reduced latency, crucial for performance-critical applications. The compact 200 WFBGA packaging not only minimizes space usage but also enhances thermal management, a vital factor in maintaining system stability and efficiency.

MT53D512M32D2NP-046 AIT:D Applications

  • Enterprise Servers: Utilized for its high bandwidth capabilities, ensuring server stability and responsiveness under heavy load conditions.
  • Data Centers: Employs large-scale data storage and fast data retrieval to handle complex computations and large data sets efficiently.
  • High-Performance Computing (HPC): Supports intensive computational tasks, providing the necessary speed and capacity for scientific simulations and financial analytics.
  • Networking Infrastructure: Applied in networking hardware to enhance data flow rates and reliability across network communications.
  • Gaming Consoles: Used to enhance gaming experience by reducing load times and increasing responsiveness, crucial for modern gaming platforms.
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