MT53D512M32D2DS-046 AAT:D TR

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Mfr.Part #
MT53D512M32D2DS-046 AAT:D TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 16GBIT 2133MHZ 200WFBGA
Stock
7,777
In Stock :
7,777

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tape and Reel (TR)
RoHS Status :
ROHS3 Compliant
Memory Size :
16Gb 512M x 32
Voltage - Supply :
1.1V
Operating Temperature :
-40°C~105°C TA
Clock Frequency :
2133MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
DRAM
Memory Type :
Volatile
Package / Case :
200-WFBGA
Mounting Type :
Surface Mount
Introducing Memory Micron Technology MT53D512M32D2DS-046 AAT:D TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~105°C TA, Package / Case:200-WFBGA, Mounting Type:Surface Mount, MT53D512M32D2DS-046 AAT:D TR pinout, MT53D512M32D2DS-046 AAT:D TR datasheet PDF, MT53D512M32D2DS-046 AAT:D TR amp .Beyond Memory Micron Technology MT53D512M32D2DS-046 AAT:D TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D512M32D2DS-046 AAT:D TR


Memory Micron Technology MT53D512M32D2DS-046 AAT:D TR Overview

The Memory Micron Technology MT53D512M32D2DS-046 AAT:D TR is a high-performance Integrated Circuit (IC) DRAM designed by Micron Technology, tailored for advanced computing solutions. With a capacity of 16 Gbit and a speed of 2133 MHz, this memory module encapsulates leading-edge technology in a 200-ball WFBGA (Fine-Pitch Ball Grid Array) package, ensuring compact integration and reliability. The product is engineered to address the rigorous demands of high-speed data processing and storage, making it an ideal choice for manufacturers looking to enhance the performance and efficiency of their systems.

MT53D512M32D2DS-046 AAT:D TR Features

This DRAM IC features a 16 Gbit density and a high-speed interface of 2133 MHz, which provides substantial bandwidth for heavy-duty operations. Its 200WFBGA packaging not only facilitates efficient thermal management but also offers robust physical protection, ensuring durability and consistent performance under various environmental conditions. The low-power design also contributes to a reduction in overall energy consumption, making it a sustainable choice for eco-conscious applications.

MT53D512M32D2DS-046 AAT:D TR Applications

  • Smartphones and Tablets: Employs high-capacity, high-speed memory to manage multiple applications simultaneously, enhancing user experience with smooth multitasking and quick access to data.
  • Server and Data Centers: Used in server memory modules to handle extensive databases and high-demand server tasks, ensuring reliable, fast data processing and improved server uptime.
  • High-Performance Computing (HPC): Supports computations that require large data sets, such as scientific simulations and complex algorithms, by providing rapid access and processing capabilities.
  • Gaming Consoles: Enhances gaming experiences by allowing for quicker load times and smoother gameplay, thanks to its high throughput and responsiveness.
  • Automotive Systems: Integrated into automotive electronics for advanced driver-assistance systems (ADAS) and infotainment systems, improving response times and reliability in critical applications.
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