MT53D512M16D1DS-046 AIT:D TR

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Mfr.Part #
MT53D512M16D1DS-046 AIT:D TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 8GBIT 2.133GHZ 200WFBGA
Stock
13,911
In Stock :
13,911

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Manufacturer :
Micron Technology
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tape and Reel (TR)
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Clock Frequency :
2.133GHz
Series :
Automotive, AEC-Q100
Package / Case :
200-WFBGA
Memory Format :
DRAM
Operating Temperature :
-40°C~95°C TC
Memory Type :
Volatile
Memory Size :
8Gb 512M x 16
Introducing Memory Micron Technology MT53D512M16D1DS-046 AIT:D TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:200-WFBGA, Operating Temperature:-40°C~95°C TC, MT53D512M16D1DS-046 AIT:D TR pinout, MT53D512M16D1DS-046 AIT:D TR datasheet PDF, MT53D512M16D1DS-046 AIT:D TR amp .Beyond Memory Micron Technology MT53D512M16D1DS-046 AIT:D TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D512M16D1DS-046 AIT:D TR


Memory Micron Technology MT53D512M16D1DS-046 AIT:D TR Overview

The Memory Micron Technology MT53D512M16D1DS-046 AIT:D TR is a cutting-edge DRAM IC that provides an impressive 8 Gbit density and a high-speed performance of 2.133 GHz. Manufactured by Micron Technology, this product is encapsulated in a 200-ball WFBGA package, designed for high-efficiency thermal management and space-saving on the circuit board. This high-capacity memory module is ideal for advanced computing and storage solutions, targeting a range of industrial applications. It ensures reliable data integrity and fast access times, essential for high-performance applications that demand robust, high-speed data handling capabilities.

MT53D512M16D1DS-046 AIT:D TR Features

This DRAM IC features 8 Gbit of high-speed data storage capacity operating at a frequency of 2.133 GHz. Its compact 200-ball WFBGA package not only facilitates efficient space utilization but also enhances thermal characteristics, ensuring stable operation under various thermal environments. The device supports high-speed data transfer, which is critical for systems requiring rapid access to large amounts of data.

MT53D512M16D1DS-046 AIT:D TR Applications

  • Enterprise Servers and Data Centers: Utilized for its high capacity and speed to manage large-scale databases and real-time data processing.
  • High-Performance Computing (HPC) Systems: Supports complex computations and simulations requiring fast data throughput and high memory bandwidth.
  • Networking Infrastructure: Applied in network routers and switches to enhance data flow management capabilities and support high-speed network backbones.
  • Consumer Electronics: Used in high-end gaming consoles and computers, providing the necessary speed and capacity to handle intensive multimedia applications and user interfaces.
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