MT53D384M32D2DS-053 XT:C TR

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Mfr.Part #
MT53D384M32D2DS-053 XT:C TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 1866MHZ 200WFBGA
Stock
16,344
In Stock :
16,344

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Manufacturer :
Micron Technology
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Supplier Device Package :
200-WFBGA (10x14.5)
Memory Size :
12Gb 384M x 32
Memory Format :
DRAM
Packaging :
Tape and Reel (TR)
Clock Frequency :
1866MHz
Memory Type :
Volatile
Package / Case :
200-WFBGA
Voltage - Supply :
1.1V
RoHS Status :
ROHS3 Compliant
Operating Temperature :
-30°C~105°C TC
Introducing Memory Micron Technology MT53D384M32D2DS-053 XT:C TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:200-WFBGA, Operating Temperature:-30°C~105°C TC, MT53D384M32D2DS-053 XT:C TR pinout, MT53D384M32D2DS-053 XT:C TR datasheet PDF, MT53D384M32D2DS-053 XT:C TR amp .Beyond Memory Micron Technology MT53D384M32D2DS-053 XT:C TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D384M32D2DS-053 XT:C TR


Memory Micron Technology MT53D384M32D2DS-053 XT:C TR Overview

The Memory Micron Technology MT53D384M32D2DS-053 XT:C TR is a cutting-edge Integrated Circuit (IC) that embodies the latest advancements in DRAM technology. Manufactured by Micron Technology, this high-capacity IC features a substantial 12GBit of DRAM, making it ideal for applications requiring extensive data handling and high-speed operations. Operating at a frequency of 1866 MHz and encapsulated in a compact 200-ball WFBGA (Fine-pitch Ball Grid Array) package, it provides robust performance and reliability for a wide range of industrial applications.

MT53D384M32D2DS-053 XT:C TR Features

  • Capacity: 12GBit of dynamic random-access memory (DRAM).
  • Speed: Fast data processing with a speed of 1866MHz.
  • Package: 200-ball WFBGA packaging ensures a minimal footprint on system boards, facilitating dense configurations and advanced system designs.

MT53D384M32D2DS-053 XT:C TR Applications

  • Advanced Computing Systems: Utilized in server farms and data centers where large memory capacity and fast access times are critical for efficient data processing.
  • Telecommunications Equipment: Essential in high-performance telecom infrastructure to manage extensive data throughput and real-time communication protocols.
  • High-End Gaming Consoles: Provides the high-speed memory necessary for detailed graphics and quick loading times in modern gaming platforms.
  • Automotive Electronics: Supports advanced automotive systems such as infotainment and autonomous driving technologies, where rapid data access and processing are vital.
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