MT53D384M32D2DS-053 WT ES:C

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Mfr.Part #
MT53D384M32D2DS-053 WT ES:C
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 1866MHZ 200WFBGA
Stock
22,838
In Stock :
22,838

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tray
Memory Format :
DRAM
Memory Type :
Volatile
Voltage - Supply :
1.1V
Operating Temperature :
-30°C~85°C TC
Clock Frequency :
1866MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
12Gb 384M x 32
Mounting Type :
Surface Mount
Package / Case :
200-WFBGA
RoHS Status :
ROHS3 Compliant
Introducing Memory Micron Technology MT53D384M32D2DS-053 WT ES:C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-30°C~85°C TC, Mounting Type:Surface Mount, Package / Case:200-WFBGA, MT53D384M32D2DS-053 WT ES:C pinout, MT53D384M32D2DS-053 WT ES:C datasheet PDF, MT53D384M32D2DS-053 WT ES:C amp .Beyond Memory Micron Technology MT53D384M32D2DS-053 WT ES:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D384M32D2DS-053 WT ES:C


Memory Micron Technology MT53D384M32D2DS-053 WT ES:C Overview

The Memory Micron Technology MT53D384M32D2DS-053 WT ES:C is a cutting-edge DRAM IC designed to meet the rigorous demands of modern high-performance computing systems. With a significant 12 Gbit capacity and a high speed of 1866 MHz, this IC offers unparalleled performance for applications requiring fast and reliable memory solutions. The compact 200-ball WFBGA package ensures it fits seamlessly into a variety of hardware configurations, making it a versatile choice for manufacturers looking to enhance their products with superior memory capabilities. This product's robust design and advanced technology make it an ideal choice for clients looking to scale their operations efficiently.

MT53D384M32D2DS-053 WT ES:C Features

This DRAM IC boasts a number of key features that distinguish it in the market. Its 12 Gbit density allows for substantial data storage and quick access, essential for complex computations and high-speed processing. The 1866 MHz clock speed enhances throughput, reducing bottlenecks and improving overall system efficiency. Additionally, the 200-ball WFBGA package offers a balance of compact form factor and excellent thermal performance, critical for maintaining reliability and longevity in intensive operational conditions.

MT53D384M32D2DS-053 WT ES:C Applications

  • High-Performance Computing (HPC): This DRAM IC is ideal for use in servers and computing clusters where high memory bandwidth and capacity are necessary for processing large datasets and performing complex calculations.
  • Advanced Gaming Systems: Utilized in gaming consoles and PCs, it provides the fast response times and large memory requirements needed to handle detailed graphics and seamless gameplay.
  • Data Centers: Essential for data storage and management solutions, this memory module supports the demands of virtualization and cloud computing, ensuring efficient data retrieval and high-speed processing.
  • Mobile Devices: Suitable for high-end smartphones and tablets, enhancing multitasking capabilities and improving user experience with quick access to stored data.
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Shipping Method

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Shipping Cost

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