MT53D384M32D2DS-053 AIT:C

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Mfr.Part #
MT53D384M32D2DS-053 AIT:C
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 1866MHZ 200WFBGA
Stock
24,564
In Stock :
24,564

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Manufacturer :
Micron Technology
Product Category :
Memory
Clock Frequency :
1866MHz
Voltage - Supply :
1.1V
Package / Case :
200-WFBGA
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Memory Format :
DRAM
Mounting Type :
Surface Mount
Packaging :
Tray
Operating Temperature :
-40°C~95°C TC
Memory Size :
12Gb 384M x 32
Introducing Memory Micron Technology MT53D384M32D2DS-053 AIT:C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~95°C TC, MT53D384M32D2DS-053 AIT:C pinout, MT53D384M32D2DS-053 AIT:C datasheet PDF, MT53D384M32D2DS-053 AIT:C amp .Beyond Memory Micron Technology MT53D384M32D2DS-053 AIT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D384M32D2DS-053 AIT:C


Memory Micron Technology MT53D384M32D2DS-053 AIT:C Overview

The Memory Micron Technology MT53D384M32D2DS-053 AIT:C is an advanced 12GBit DRAM component designed for high-speed performance and reliability. Manufactured by Micron Technology, one of the leading companies in memory and storage solutions, this IC leverages cutting-edge technology to provide top-notch performance with a speed of 1866MHz. Its compact 200WFBGA packaging ensures it can be integrated into various applications where space and power efficiency are crucial. Ideal for businesses requiring high memory bandwidth and density, this product exemplifies reliability and efficiency in handling large-scale data processes.

MT53D384M32D2DS-053 AIT:C Features

This DRAM IC stands out with its 12GBit capacity and a rapid 1866MHz clock speed, ensuring efficient processing of large data volumes. Its 200-ball fine-pitch BGA (WFBGA) package allows for robust physical and electrical connectivity, contributing to improved signal integrity and thermal management. These characteristics make the MT53D384M32D2DS-053 AIT:C an excellent choice for demanding computing environments.

MT53D384M32D2DS-053 AIT:C Applications

  • Server and Enterprise Solutions: Enables robust and scalable memory architectures for data centers and enterprise servers, improving overall system performance and reliability.
  • Networking Equipment: Utilized in routers and switches, where high bandwidth and data integrity are necessary for managing network traffic efficiently.
  • Telecommunications Systems: Supports high-speed communications infrastructure, including 5G networks, by providing the necessary memory capacity and speed for data-intensive applications.
  • High-Performance Computing (HPC): Ideal for scientific and financial modeling where rapid data processing and large memory pools are required for complex computations.
  • Consumer Electronics: Used in high-end gaming consoles and PCs, enhancing the gaming experience with faster load times and smoother gameplay.
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