MT53D384M32D2DS-053 AAT ES:C TR

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Mfr.Part #
MT53D384M32D2DS-053 AAT ES:C TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 12GBIT 1866MHZ 200WFBGA
Stock
18,063
In Stock :
18,063

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Manufacturer :
Micron Technology
Product Category :
Memory
Packaging :
Tape and Reel (TR)
RoHS Status :
ROHS3 Compliant
Memory Format :
DRAM
Supplier Device Package :
200-WFBGA (10x14.5)
Voltage - Supply :
1.1V
Mounting Type :
Surface Mount
Memory Size :
12Gb 384M x 32
Package / Case :
200-WFBGA
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
1866MHz
Operating Temperature :
-40°C~105°C TA
Introducing Memory Micron Technology MT53D384M32D2DS-053 AAT ES:C TR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:200-WFBGA, Operating Temperature:-40°C~105°C TA, MT53D384M32D2DS-053 AAT ES:C TR pinout, MT53D384M32D2DS-053 AAT ES:C TR datasheet PDF, MT53D384M32D2DS-053 AAT ES:C TR amp .Beyond Memory Micron Technology MT53D384M32D2DS-053 AAT ES:C TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D384M32D2DS-053 AAT ES:C TR


Memory Micron Technology MT53D384M32D2DS-053 AAT ES:C TR Overview

The Memory Micron Technology MT53D384M32D2DS-053 AAT ES:C TR is a cutting-edge DRAM module designed for high-performance applications requiring substantial data throughput and storage. Manufactured by Micron Technology, one of the leading names in memory and storage solutions, this IC DRAM module features a substantial 12Gbit capacity with a speed of 1866MHz. Packaged in a 200-ball WFBGA (Fine Pitch Ball Grid Array), it offers enhanced thermal performance and space efficiency, making it ideal for advanced computing environments where reliability and high density are crucial. Its robust design and high-speed capabilities make it a standout choice for businesses looking to leverage advanced memory technology for improved system performance.

MT53D384M32D2DS-053 AAT ES:C TR Features

This DRAM module boasts several key features that make it suitable for a variety of demanding applications. The 12Gbit density allows for significant storage capacity within a single module, facilitating complex processes and large-scale operations. With a clock speed of 1866MHz, it ensures rapid data access and processing, enhancing overall system efficiency. The 200WFBGA package is not only compact but also offers excellent thermal properties and reliability, essential for maintaining system stability under high loads.

MT53D384M32D2DS-053 AAT ES:C TR Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computers, this DRAM helps manage large datasets and complex computations efficiently.
  • Networking Infrastructure: Supports high-speed network applications, including switches and routers, where rapid data buffering and transfer are necessary.
  • Telecommunications Equipment: Essential for telecommunications systems requiring high memory capacity for data management and signal processing.
  • Gaming Consoles: Enhances the gaming experience by providing high-speed memory that supports advanced graphics and seamless gameplay.
  • Data Centers: Ideal for data storage and processing needs of large data centers, improving access speeds and reliability in cloud services and virtualization environments.
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Shipping Cost

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