MT53D1G64D8NZ-046 WT ES:E

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Mfr.Part #
MT53D1G64D8NZ-046 WT ES:E
Manufacturer
Micron Technology
Package / Case
376-WFBGA
Datasheet
Download
Description
IC DRAM 64GBIT 2133MHZ 376WFBGA
Stock
8,497
In Stock :
8,497

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Manufacturer :
Micron Technology
Product Category :
Memory
Operating Temperature :
-30°C~85°C TC
Voltage - Supply :
1.1V
Clock Frequency :
2133MHz
Mounting Type :
Surface Mount
Memory Type :
Volatile
Packaging :
Tray
Package / Case :
376-WFBGA
Memory Size :
64Gb 1G x 64
Memory Format :
DRAM
Introducing Memory Micron Technology MT53D1G64D8NZ-046 WT ES:E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-30°C~85°C TC, Mounting Type:Surface Mount, Package / Case:376-WFBGA, MT53D1G64D8NZ-046 WT ES:E pinout, MT53D1G64D8NZ-046 WT ES:E datasheet PDF, MT53D1G64D8NZ-046 WT ES:E amp .Beyond Memory Micron Technology MT53D1G64D8NZ-046 WT ES:E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53D1G64D8NZ-046 WT ES:E


Memory Micron Technology MT53D1G64D8NZ-046 WT ES:E Overview

The Memory Micron Technology MT53D1G64D8NZ-046 WT ES:E represents a state-of-the-art Integrated Circuit (IC) component specifically designed for high-performance computing systems. This DRAM (Dynamic Random-Access Memory) module boasts a substantial 64Gbit capacity and operates at a speed of 2133MHz. Encapsulated in a compact 376-ball fine pitch ball grid array (WFBGA), this product offers high-density memory storage while maintaining excellent power efficiency and reliability, ideal for applications requiring rapid access to large amounts of data.

MT53D1G64D8NZ-046 WT ES:E Features

This IC DRAM from Micron Technology incorporates several key features that enhance its performance and suitability for sophisticated electronics. The 2133MHz clock speed ensures swift data processing capabilities. Its 64Gbit density allows for expansive memory in a singular compact module, which is critical for minimizing physical space usage in hardware design. The 376WFBGA packaging not only provides robust protection but also facilitates efficient thermal management, ensuring the module's reliability under varying operational conditions.

MT53D1G64D8NZ-046 WT ES:E Applications

  • Advanced Computing Systems: Utilized in server farms and data centers, this DRAM module supports extensive multitasking and high-speed data processing, enhancing overall system performance.
  • Networking Hardware: Integral for routers, switches, and other networking equipment, where high capacity and fast memory are crucial for managing large volumes of data traffic efficiently.
  • Consumer Electronics: Applied in high-performance gaming consoles and computers, enabling rapid loading times and improved gameplay experiences.
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