MT53B512M32D2DS-062 AAT:C
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- Mfr.Part #
- MT53B512M32D2DS-062 AAT:C
- Manufacturer
- Micron Technology
- Package / Case
- 200-WFBGA
- Datasheet
- Download
- Description
- IC DRAM 16GBIT 1600MHZ 200WFBGA
- Stock
- 34,894
- In Stock ：
- 34,894
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Operating Temperature :
- -40°C~105°C TA
- Memory Format :
- DRAM
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 1.1V
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 6 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 200-WFBGA
- Memory Size :
- 16Gb 512M x 32
- Memory Type :
- Volatile
- Clock Frequency :
- 1600MHz
- Datasheets
- MT53B512M32D2DS-062 AAT:C
Memory Micron Technology MT53B512M32D2DS-062 AAT:C Overview
The Memory Micron Technology MT53B512M32D2DS-062 AAT:C is an advanced 16Gb DRAM integrated circuit from Micron Technology, specifically designed to meet the demanding requirements of high-performance computing systems. This IC features a 1600MHz clock speed and utilizes a 200-ball WFBGA package for superior thermal management and space efficiency. Ideal for applications requiring high-speed data processing and large storage capacities, this product is engineered to support the needs of both current and emerging technologies in data-centric environments. Its robust design and high bandwidth capabilities make it an excellent choice for manufacturers looking to enhance the performance and reliability of their systems.
MT53B512M32D2DS-062 AAT:C Features
The MT53B512M32D2DS-062 AAT:C DRAM IC is packed with features that make it a standout option for system developers and OEMs. Key features include a 16Gbit density, high-speed data transfer rates at 1600MHz, and low-power consumption thanks to its advanced fabrication technology. Additionally, its 200-ball fine-pitch BGA packaging ensures a compact footprint while offering enhanced thermal characteristics, crucial for maintaining system stability and efficiency under load.
MT53B512M32D2DS-062 AAT:C Applications
- Advanced Computing Systems: Utilized in server farms and high-performance computing clusters where speed and capacity are critical for handling large volumes of data efficiently.
- Mobile and Embedded Systems: Suitable for use in sophisticated mobile devices and embedded systems requiring compact, high-density memory solutions that do not compromise on speed.
- Networking Hardware: Deployed in routers, switches, and other networking equipment to enhance data throughput and reliability in communication infrastructure.
- Consumer Electronics: Integrated into consumer electronics such as smart TVs and gaming consoles, where its high bandwidth and storage capacity improve user experience by enabling more responsive and feature-rich applications.
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