MT53B256M32D1NP-062 WT:C

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Mfr.Part #
MT53B256M32D1NP-062 WT:C
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 8GBIT 1600MHZ 200WFBGA
Stock
1,199
In Stock :
1,199

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Size :
8Gb 256M x 32
Package / Case :
200-WFBGA
Memory Format :
DRAM
Packaging :
Tray
Voltage - Supply :
1.1V
Factory Lead Time :
9 Weeks
Mounting Type :
Surface Mount
Clock Frequency :
1600MHz
Memory Type :
Volatile
Operating Temperature :
-30°C~85°C TC
Introducing Memory Micron Technology MT53B256M32D1NP-062 WT:C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:200-WFBGA, Mounting Type:Surface Mount, Operating Temperature:-30°C~85°C TC, MT53B256M32D1NP-062 WT:C pinout, MT53B256M32D1NP-062 WT:C datasheet PDF, MT53B256M32D1NP-062 WT:C amp .Beyond Memory Micron Technology MT53B256M32D1NP-062 WT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B256M32D1NP-062 WT:C


Memory Micron Technology MT53B256M32D1NP-062 WT:C Overview

The Memory Micron Technology MT53B256M32D1NP-062 WT:C is a high-performance IC DRAM component featuring a robust storage capacity of 8 Gbit and a speed of 1600 MHz, packaged in a compact 200-ball WFBGA format. This product from Micron Technology integrates advanced memory technology and design to cater to demanding applications, offering both high capacity and speed efficiency. It is specifically designed for applications requiring substantial data bandwidth and lower latency, making it an ideal solution for advanced computing and digital processing needs. The Memory Micron Technology MT53B256M32D1NP-062 WT:C ensures reliability and performance, which are critical for system stability and swift data access.

MT53B256M32D1NP-062 WT:C Features

  • 8 Gbit Density: Large storage capacity suitable for intensive memory applications.
  • 1600 MHz Speed: High-speed memory access to enhance system performance.
  • 200-ball WFBGA Package: Compact and efficient packaging allows for better thermal performance and reduced space requirement on PCBs.
  • Lower Power Consumption: Designed for energy efficiency, reducing overall system power requirements and enhancing battery life in portable applications.

MT53B256M32D1NP-062 WT:C Applications

  • Advanced Computing Systems: Utilized in server and high-performance computing platforms to manage large volumes of data efficiently.
  • Smartphones and Tablets: Supports high-speed memory requirements for multitasking and media applications, ensuring smooth operation and enhanced user experience.
  • Digital Cameras and Surveillance Systems: Enables high-resolution image processing and storage, critical for modern high-definition digital imaging and security systems.
  • Automotive Electronics: Integrated into automotive infotainment and advanced driver assistance systems (ADAS) for reliable and rapid data processing.
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