MT53B256M32D1DS-062 XT:C TR

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Mfr.Part #
MT53B256M32D1DS-062 XT:C TR
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 8GBIT 1600MHZ 200WFBGA
Stock
28,600
In Stock :
28,600

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Manufacturer :
Micron Technology
Product Category :
Memory
Voltage - Supply :
1.1V
Clock Frequency :
1600MHz
RoHS Status :
ROHS3 Compliant
Packaging :
Tape and Reel (TR)
Memory Format :
DRAM
Memory Size :
8Gb 256M x 32
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-30°C~105°C TC
Mounting Type :
Surface Mount
Package / Case :
200-WFBGA
Memory Type :
Volatile
Introducing Memory Micron Technology MT53B256M32D1DS-062 XT:C TR from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-30°C~105°C TC, Mounting Type:Surface Mount, Package / Case:200-WFBGA, MT53B256M32D1DS-062 XT:C TR pinout, MT53B256M32D1DS-062 XT:C TR datasheet PDF, MT53B256M32D1DS-062 XT:C TR amp .Beyond Memory Micron Technology MT53B256M32D1DS-062 XT:C TR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B256M32D1DS-062 XT:C TR


Memory Micron Technology MT53B256M32D1DS-062 XT:C TR Overview

The Memory Micron Technology MT53B256M32D1DS-062 XT:C TR is a cutting-edge IC DRAM designed by Micron Technology, renowned for its high-speed and high-capacity memory solutions. This product boasts an impressive 8 Gbit density with a swift 1600 MHz speed, encapsulated in a compact 200-ball WFBGA (Fine-Pitch Ball Grid Array) package. It is engineered to meet the rigorous demands of modern applications, offering exceptional reliability and performance enhancements that are pivotal for advanced computing systems. The integration of advanced memory technology ensures substantial throughput and low-latency response times, making it an ideal choice for manufacturers seeking to enhance their systems' memory bandwidth and performance.

MT53B256M32D1DS-062 XT:C TR Features

This dynamic memory module features an 8 Gbit DRAM with a robust 1600 MHz clock speed, ensuring high-speed data transfer rates that are essential for performance-critical applications. The 200-ball WFBGA package not only minimizes the module's footprint but also enhances its thermal management and reliability. With its high data bandwidth, the MT53B256M32D1DS-062 XT:C TR is tailored to deliver superior performance, facilitating smoother and more efficient operation in demanding environments.

MT53B256M32D1DS-062 XT:C TR Applications

  • High-Performance Computing (HPC): Utilized in servers and workstations for complex computations, simulations, and large-scale data processing. The high bandwidth and capacity of the MT53B256M32D1DS-062 XT:C TR facilitate rapid data access and processing speeds that are crucial in these environments.
  • Advanced Graphics Processing: Ideal for graphics-intensive applications such as 3D rendering and gaming consoles, where large amounts of data need to be accessed quickly to deliver seamless graphics performance.
  • Telecommunications Infrastructure: Employed in network devices that require high-speed memory for buffering large volumes of data, ensuring efficient data flow and system reliability in communication networks.
  • Automotive Systems: Used in advanced driver-assistance systems (ADAS) and infotainment systems, where reliable and fast memory is essential for real-time processing and responsiveness.
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