MT53B256M32D1DS-062 XT:C

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Mfr.Part #
MT53B256M32D1DS-062 XT:C
Manufacturer
Micron Technology
Package / Case
200-WFBGA
Datasheet
Download
Description
IC DRAM 8GBIT 1600MHZ 200WFBGA
Stock
13,521
In Stock :
13,521

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Format :
DRAM
Operating Temperature :
-30°C~105°C TC
Voltage - Supply :
1.1V
Packaging :
Tray
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
8Gb 256M x 32
Clock Frequency :
1600MHz
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Package / Case :
200-WFBGA
Introducing Memory Micron Technology MT53B256M32D1DS-062 XT:C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-30°C~105°C TC, Mounting Type:Surface Mount, Package / Case:200-WFBGA, MT53B256M32D1DS-062 XT:C pinout, MT53B256M32D1DS-062 XT:C datasheet PDF, MT53B256M32D1DS-062 XT:C amp .Beyond Memory Micron Technology MT53B256M32D1DS-062 XT:C ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology MT53B256M32D1DS-062 XT:C


Memory Micron Technology MT53B256M32D1DS-062 XT:C Overview

Introducing the Memory Micron Technology MT53B256M32D1DS-062 XT:C, a high-performance 8Gbit DRAM from Micron Technology. This integrated circuit is tailored for advanced computing solutions, providing robust data management with a speed of 1600MHz and packaged in a compact 200-ball WFBGA. Designed to handle intensive applications and large datasets, this memory module is essential for businesses looking to scale up their technological infrastructure. Its reliability and efficiency make it an ideal choice for high-demand systems, ensuring smooth operation and enhanced processing capabilities.

MT53B256M32D1DS-062 XT:C Features

The MT53B256M32D1DS-062 XT:C DRAM boasts significant features that contribute to its superior performance. Key attributes include a large 8Gbit capacity, high-speed performance at 1600MHz, and low-power consumption, which helps in reducing the overall energy expenditure of systems. Additionally, its 200-ball WFBGA packaging ensures a minimal footprint on the system board, facilitating more compact designs and improved thermal management.

MT53B256M32D1DS-062 XT:C Applications

  • Advanced Computing Systems: Utilizes high-capacity memory for efficient data processing in complex computations and algorithms.
  • Enterprise Servers: Supports large-scale applications requiring extensive data storage and rapid access speeds to enhance server responsiveness and reliability.
  • Mobile Devices: Provides the memory capacity necessary for high-performance applications and multitasking environments in smartphones and tablets.
  • Gaming Consoles: Enhances gaming experiences by supporting high-resolution graphics and fast loading times.
  • Automotive Systems: Used in advanced driver-assistance systems (ADAS) to process and store large amounts of real-time data for vehicle safety and navigation aids.
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